Senior HBM Test & Yield Engineer

Micron Technology, Inc.; Singapore; On-site; SGD 110,000 - 170,000; Full time

Job summary

Micron Technology, Inc. is seeking a technical professional to lead Media Health manufacturing execution for next‑gen HBM products. You will own test coverage, drive yield improvements, and validate device and stack reliability through advanced test strategies.

You will collaborate with Fab, Design Engineering, and Technology Development to accelerate design-for-test, cost reduction, and cycle-time improvements across DRAM die, interface die, and stacked die solutions.

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
• Solid understanding of CMOS technology, DRAM architecture, and device physics.
• Experience with data analysis, statistics, and scripting (Python or JMP).

Responsibilities

• Optimized Test Coverage: ensure optimized test coverage on current and future HIG HBM architectures.
• Product Development and Validation: develop, validate, characterize, and qualify Micron’s next-generation HBM products.
• Cross-functional collaboration: work with Fab, Design Engineering, Technology Development, and Test Solutions Engineering.

Skills

Semiconductor devices

Circuit design

Product validation

CMOS technology

DRAM architecture

Data analysis

Python scripting

Problem solving

Education

Bachelor's or Master’s degree in Electrical and Electronics Engineering

Tools

Python

JMP

Job description

Micron Technology, Inc. is seeking a technical professional to lead Media Health manufacturing execution for next‑gen HBM products. You will own test coverage, drive yield improvements, and validate device and stack reliability through advanced test strategies.

You will collaborate with Fab, Design Engineering, and Technology Development to accelerate design-for-test, cost reduction, and cycle-time improvements across DRAM die, interface die, and stacked die solutions.