Senior Engineer, HBM Product & Test Innovation Lead

Micron Technology

Singapore

Presencial

SGD 120 000 - 160 000

Tempo integral

14 dias+

Uma candidatura completa num minuto

Currículo e carta de apresentação personalizados, prontos a enviar.

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Resumo da oferta

Micron Technology is seeking a senior technical contributor for HBM product engineering and media health. You will drive test flow, yield improvement, and cost reduction for next-gen HBM products, collaborating with fab, design, and development teams to deliver high-quality memory solutions.

Role requires deep semiconductor knowledge, strong problem-solving, and the ability to mentor others while leading cross-functional initiatives in a fast-paced environment.

Qualificações

  • Experience with semiconductor devices, circuit design, or product validation.
  • Familiarity with CMOS technology and DRAM architecture concepts.
  • Data analysis and scripting with Python or JMP.
  • Strong problem-solving and analytical abilities.

Responsabilidades

  • Optimized test coverage for current/future HBM architectures to ensure efficiency in high-volume manufacturing.
  • Developed, validated and qualified next-generation HBM products including stack and DRAM components.
  • Provided design verification support using CAD tools and Verilog simulations.
  • Improved yield and reduced test time by addressing device and stack yields.
  • Identified root causes of test-flow issues and implemented corrective actions.
  • Mentored teammates, managed projects, and supported cross-functional decisions.

Conhecimentos

Semiconductor devices
Circuit design
Product validation
Python
JMP
Data analysis
Problem solving
Team collaboration

Formação académica

Bachelor’s or Master’s degree in Electrical and Electronics Engineering

Ferramentas

CAD tools
Verilog simulations
JMP

Descrição da oferta de emprego

Micron Technology is seeking a senior technical contributor for HBM product engineering and media health. You will drive test flow, yield improvement, and cost reduction for next-gen HBM products, collaborating with fab, design, and development teams to deliver high-quality memory solutions.

Role requires deep semiconductor knowledge, strong problem-solving, and the ability to mentor others while leading cross-functional initiatives in a fast-paced environment.

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