Staff/Principal: Advanced Packaging & Wafer-Level Tech

Micron Technology

Singapore

On-site

SGD 120,000 - 180,000

Full time

4 days ago

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Job summary

Micron Technology in Singapore is seeking a highly skilled professional to join the AI-enabled Advanced Packaging Technology Development team. The role focuses on developing post-fab wafer finishing processes for high performance memory products, coordinating cross‑functional teams to deliver robust, cost-effective manufacturing solutions.

You will drive process development, equipment evaluation, quality improvements, and data analytics, applying AI tools where suitable and contributing to

Qualifications

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in a related field.
Semiconductor process development experience, wafer bonding, plating, warpage control and packaging preferred.

Responsibilities

Develop and enable deployment of post-fab wafer finishing processes to meet performance, cost, reliability and schedule requirements.
Collaborate with Package Integration, Assembly Engineering, and other teams to transfer technology to manufacturing.
Provide POR and MOR documentation for product transfer to high volume manufacturing.

Skills

Python

SQL

Visual Basic for automation

FDC

RMS

Data analytics

Process knowledge

Education

PhD or Master’s or Bachelor in Electrical Engineering / Materials Science / Chemical Engineering / Physics

Tools

Automation tooling (VB)

E3 (equipment software)

FDC (fault detection)

RMS (Recipe Management)

Job description

You will drive process development, equipment evaluation, quality improvements, and data analytics, applying AI tools where suitable and contributing to

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