Senior Engineer – Advanced Packaging & Yield

Micron Technology; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology in Singapore is seeking a skilled professional to develop and optimize assembly processes for advanced packaging technologies in high-performance memory products. The role requires collaboration with various teams to ensure technology development aligns with business objectives.

The ideal candidate will have a degree in a related technical field and 2+ years of experience in semiconductor processes, along with proficiency in Python, R, and SQL. Focus on quality improvement and cost reduction is essential.

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Qualifications

• 2+ years of semiconductor process development experience, preferably in wafer bonding and packaging.
• Experience with Visual Basic for automation and tool integration.
• Strong understanding of process flows and how changes affect yield and reliability.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Collaborate with stakeholders to build and execute technology development strategies.

Skills

Proficiency in Python

Proficiency in R

Proficiency in SQL

Strong data analytics capabilities

Education

B.S., M.S., or Ph.D. in Materials Science or related fields

Tools

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

Micron Technology in Singapore is seeking a skilled professional to develop and optimize assembly processes for advanced packaging technologies in high-performance memory products. The role requires collaboration with various teams to ensure technology development aligns with business objectives.

The ideal candidate will have a degree in a related technical field and 2+ years of experience in semiconductor processes, along with proficiency in Python, R, and SQL. Focus on quality improvement and cost reduction is essential.

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