Staff/Principal Engineer, Advanced Packaging (Singapore)

Micron Technology, Inc; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology, Inc. is seeking a Staff/Principal Engineer for APTD CEM in Singapore to develop advanced packaging die-level technologies.

You will lead process development, equipment evaluation, and quality improvement across cross-functional teams, enabling wafer-level packaging and die stacking. The role emphasizes AI-enabled insights, data analytics, and collaboration with global teams to transition new tech from development to high-volume manufacturing.

Qualifications

• PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in related field.
• Experience in semiconductor process development or equipment evaluation, especially wafer bonding, die stacking and packaging.
• Strong data analytics, SPC/DOE, and process-control experience.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Evaluate and promote new equipment and materials to enhance capabilities.
• Ensure quality improvement through defect analysis and advanced controls.
• Collaborate with Package Integration, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality teams to ensure smooth transfer to high volume production.

Skills

Python

R

SQL

Visual Basic for automation

Data analytics

Education

Bachelor's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

Master's degree in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

PhD in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field

Tools

E3

FDC

RMS

Job description

Micron Technology, Inc. is seeking a Staff/Principal Engineer for APTD CEM in Singapore to develop advanced packaging die-level technologies.

You will lead process development, equipment evaluation, and quality improvement across cross-functional teams, enabling wafer-level packaging and die stacking. The role emphasizes AI-enabled insights, data analytics, and collaboration with global teams to transition new tech from development to high-volume manufacturing.