AI-Driven Advanced Packaging Senior Engineer

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

On-site

SGD 120,000 - 180,000

Full time

3 days ago

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Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD is seeking an Advanced Packaging Integration Engineer to lead deployment of advanced packaging technologies and drive yield, quality, and manufacturability improvements. You will collaborate with global teams to transition from development to high-volume production and integrate AI-enabled insights into daily workflows.

Ideal candidates hold a PhD or equivalent with several years in semiconductor packaging, and are proficient in Python, R, SQL, and

Qualifications

PhD with ≥2 years, or Master’s with ≥5 years, or Bachelor’s with ≥7 years in Electrical Engineering, Materials Science, Chemical Engineering, Physics, or related field.
Semiconductor process integration experience, preferably with know‑how to develop and enable advanced package technology for post‑fab wafer finish and assembly processes.

Responsibilities

Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
Integrate semiconductors while partnering with process and product engineering teams.
Provide AI-assisted tools and insights to improve efficiency, quality, or effectiveness.