Senior Advanced Packaging Engineer - AI-Driven Yield

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

5 days ago

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Job summary

Micron Semiconductor Asia Operations PTE. LTD. is seeking an Advanced Packaging Integration Engineer to advance packaging technology for post-fab processes and to drive yield, quality, and cost improvements.

You will work with internal and external teams across the organization to deploy new integration flows, ensuring smooth transfer from development to high-volume production while applying AI-assisted tools for efficiency and decision-making.

Qualifications

PhD/MSc/BSc with relevant experience in electrical engineering, materials science, chemical engineering or physics.
Experience in semiconductor process integration and advanced packaging for post-fab processes is preferred.
Strong data analytics and programming skills to support engineering decisions.

Responsibilities

Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
Improve product quality, drive yield improvements, reduce costs, and enhance productivity.
Integrate semiconductors while partnering with process and product engineering teams.
Collaborate with Probe, Yield Analysis, Test, and Product Engineering teams to drive improvements.
Establish defense coverage through process measurement, inspection, and testing.