AI-Driven Engineer, Advanced Packaging

Micron Technology, Inc

Singapore

On-site

SGD 70,000 - 110,000

Full time

5 days ago

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Job summary

Micron Technology, Inc. is seeking engineers to join the Package Development Engineering Team in Singapore.

This contributor role focuses on advancing next-generation memory and HBM packaging, transitioning new products from development to high-volume manufacturing in collaboration with Development, Manufacturing and supplier teams globally. The role emphasizes AI-enabled tooling, data-driven improvements, and seamless tech transfer to scale production while meeting quality and reliability

Qualifications

Bachelor’s degree or higher in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, or related discipline.

Responsibilities

Integrate AI-assisted tools and insights to improve efficiency, quality, or effectiveness.
Contribute to continuous improvement by identifying, testing, and sharing AI-enabled enhancements within scope of work.
Apply engineering and statistical methods to accelerate learning cycles from DOE through product qualifications.
Partner with Advanced Package Technology Development and manufacturing for Low Volume Manufacturing and Run at Risk support.
Perform FMEA risk assessments and implement corrective actions for abnormal conditions.
Enable smooth technology transfer from development to high-volume manufacturing.