Principal Engineer – AI-Driven Advanced Packaging

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.

Singapore

On-site

SGD 120,000 - 180,000

Full time

5 days ago

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Job summary

Micron Semiconductor Asia Operations PTE. LTD. is seeking a PhD with related field experience to lead advanced packaging process development.

You will develop and optimize assembly processes for wafer‑level packaging and die stacking to meet performance, yield, cost, reliability and schedule targets. Collaborate with Package Integration, Assembly Engineering, Front End Wafer Fab, and Global Quality to transfer new technologies to high‑volume production and deliver POR/MOR documentation for

Qualifications

PhD or Master’s degree with relevant experience in semiconductor process development or packaging.
Experience with wafer bonding, die stacking, and packaging.
Strong data analytics, DOE, SPC, and dashboarding capabilities.
Proficiency in Python, R, SQL for modelling and analysis.

Responsibilities

Develop and optimize assembly processes for wafer‑level packaging and die stacking to meet performance, yield, cost, reliability and schedule targets.
Improve product quality, drive yield improvements, reduce costs, and enhance productivity.
Collaborate with cross‑functional teams to transfer technology to production and assure smooth ramp‑to‑high‑volume manufacturing.
Provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to manufacturing facilities.
Apply AI‑enabled tools to improve efficiency, quality and problem solving.