Semiconductor Packaging Process Engineer - Flip Chip

RF360 SINGAPORE PTE. LTD.

Singapore

On-site

SGD 55,000 - 75,000

Full time

7 days ago

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Job summary

RF360 SINGAPORE PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding, and mounting. You will provide day-to-day engineering support to meet production goals.

The role emphasizes data-driven problem solving, continuous improvement, and close collaboration with production, equipment, quality, planning, and other teams in a fast-paced manufacturing environment.

Qualifications

Bachelor’s degree in engineering or related discipline.
2+ years of experience as a Process Engineer in semiconductor backend manufacturing or assembly.
Fresh graduates with strong technical aptitude may be considered.

Responsibilities

Provide engineering support for backend packaging processes (wafer bumping, singulation, grinding, mounting).
Support daily production to meet output and quality targets.
Monitor process data to identify trends and improvement opportunities.
Lead troubleshooting for process abnormalities, yield issues, and quality excursions.
Drive corrective and preventive actions for chronic quality issues.
Collaborate with cross-functional teams to ensure production readiness.