Semiconductor Packaging Applications Engineer

THE SUPREME HR ADVISORY PTE. LTD.; Singapore; On-site; SGD 33,000 - 67,000; Full time

Job summary

The Supreme HR Advisory Pte. Ltd. is seeking a highly skilled engineer to lead the design, development, optimization, and validation of software and hardware for advanced die bonding processes, with on-site customer support in Woodlands North Coast, Singapore.

Requirements include a engineering degree, 3+ years in semiconductor packaging, and hands-on troubleshooting in a high-tech setting. Travel for installations may be required.

Qualifications

• Bachelor’s or Master’s degree in Engineering (Mechanical, Electrical, Materials, or related field).
• 3+ years of experience in semiconductor packaging, die bonding equipment, or advanced electronics manufacturing preferred.
• Strong knowledge of advanced packaging technologies, such as Flip-Chip, PoP, wafer-level, or panel-level bonding.
• Experience with semiconductor equipment integration, motion control systems, and process development.
• Hands-on troubleshooting and problem-solving skills in a high-tech manufacturing or lab environment.
• Willingness to travel for customer support and on-site installations (as required).

Responsibilities

• Lead the design, development, optimization, and validation of software and hardware applications for advanced die bonding processes.
• Analyze customer requirements and translate them into customized semiconductor packaging solutions.
• Troubleshooting and failure analysis of die attach tools and processes; implement corrective actions.
• Perform machine setup, calibration, and alignment to ensure optimal process performance and yield.
• Develop test procedures and application recipes for process qualification and validation; maintain logs.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams to address challenges and implement improvements.
• Provide on-site support for complex customer applications, including training and coaching for field engineers and customers.
• Serve as a key interface between customers and the R&D team, delivering user feedback to guide tool enhancements.

Job description

The Supreme HR Advisory Pte. Ltd. is seeking a highly skilled engineer to lead the design, development, optimization, and validation of software and hardware for advanced die bonding processes, with on-site customer support in Woodlands North Coast, Singapore.

Requirements include a engineering degree, 3+ years in semiconductor packaging, and hands-on troubleshooting in a high-tech setting. Travel for installations may be required.