Semiconductor Packaging Applications Engineer

Recruit Express Pte Ltd; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Recruit Express Pte Ltd in Singapore seeks an experienced engineer to lead design, development, and validation of software and hardware for advanced die bonding processes.

You will translate customer requirements into optimized packaging solutions, troubleshoot tool and process issues, and collaborate with R&D, software, mechanics, and quality teams to implement improvements. On-site support and customer training are essential parts of the role.

Qualifications

• Must have strong knowledge of advanced packaging technologies (Flip-Chip, PoP, wafer- or panel-level bonding).
• Experience with semiconductor equipment integration and motion control systems.
• Hands-on troubleshooting and problem-solving in high-tech manufacturing or lab settings.
• Excellent written and spoken communication; able to work cross-functionally.

Responsibilities

• Lead design, development, optimization, and validation of software and hardware for die bonding processes.
• Analyze customer requirements into customized packaging solutions with focus on process optimization.
• Troubleshoot die attach tools, process issues, and software anomalies; implement corrective actions.
• Perform machine setup, calibration, and alignment to ensure repeatable performance and yield.
• Develop test procedures, recipes, and documentation for process qualification and validation.
• Collaborate with R&D, software, mechanical, electrical, quality, and manufacturing teams.
• Provide on-site support for customer applications, including training for field engineers and customers.
• Interface between customers and R&D to relay feedback for tool enhancements.

Skills

Advanced packaging technologies

Equipment integration

Motion control systems

Troubleshooting

Communication & teamwork

Travel readiness

Education

Bachelor's or Master’s degree in Engineering (Mechanical, Electrical, Materials)

Job description

Recruit Express Pte Ltd in Singapore seeks an experienced engineer to lead design, development, and validation of software and hardware for advanced die bonding processes.

You will translate customer requirements into optimized packaging solutions, troubleshoot tool and process issues, and collaborate with R&D, software, mechanics, and quality teams to implement improvements. On-site support and customer training are essential parts of the role.