Flip-Chip Packaging Process Engineer – Yield & Optimization

Qualcomm; Singapore; On-site; SGD 67,000 - 100,000; Full time

Job summary

RF360 Singapore Pte., Ltd. is seeking a Hardware Process Engineer to plan, design, optimize, verify, and test electronic systems across Digital/Analog/RF/optical domains.

You will bring up yield, circuits, and packaging, and collaborate with cross-functional teams to meet performance targets. The role emphasizes process engineering, continuous improvement, and strong data-driven problem solving in a dynamic semiconductor manufacturing environment.

Qualifications

• Bachelor’s Degree in Engineering, preferably Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• 2+ years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
• Fresh graduates with strong technical aptitude may be considered.

Responsibilities

• Provide engineering support for backend semiconductor packaging processes, including flip chip bonding, reflow soldering and plasma cleaning.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Skills

Data analysis

Problem solving

Communication

Planning

Organization

Cross-functional collaboration

Education

Bachelor's degree in Engineering

Tools

Microsoft PowerPoint

Microsoft Excel

Microsoft Word

SPC

MSA

Job description

RF360 Singapore Pte., Ltd. is seeking a Hardware Process Engineer to plan, design, optimize, verify, and test electronic systems across Digital/Analog/RF/optical domains.

You will bring up yield, circuits, and packaging, and collaborate with cross-functional teams to meet performance targets. The role emphasizes process engineering, continuous improvement, and strong data-driven problem solving in a dynamic semiconductor manufacturing environment.