MEMS Packaging Engineer: WLCSP & Bumping Expert

Sitime-Corporation; Singapore; On-site; SGD 90,000 - 130,000; Full time

Benefits offered by this job

Quarterly bonus

Equity grants

Job summary

SiTime in Singapore is seeking a Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, including bumping, RDL, underfill, and die packaging. You will work across R&D, design, and manufacturing to ensure high quality and yield in a fast-paced semiconductor environment.

The role emphasizes hands-on development and collaboration to drive process improvements and technology roadmaps in a dynamic, innovative organization.

Responsibilities

• Develop, optimize, and characterize packaging processes for WLCSP technologies, including bumping, RDL formation, underfill, and dicing.
• Perform root cause analysis and implement corrective actions for process-related issues and defects using 8D methodology.
• Collaborate with R&D, design, equipment, and manufacturing teams to ensure smooth transfer from development to high-volume manufacturing.
• Lead or participate in cross-functional teams for new product introduction and process improvement projects.
• Evaluate and qualify new materials, equipment, and processes to support technology roadmaps and production requirements.
• Stay updated with latest industry trends and advancements in packaging technologies.

Job description

SiTime in Singapore is seeking a Packaging Process Engineer to develop, optimize, and sustain advanced packaging processes for WLCSP, including bumping, RDL, underfill, and die packaging. You will work across R&D, design, and manufacturing to ensure high quality and yield in a fast-paced semiconductor environment.

The role emphasizes hands-on development and collaboration to drive process improvements and technology roadmaps in a dynamic, innovative organization.