Process Engineer – Flip Chip Bonding Process

RF360 SINGAPORE PTE. LTD.; Singapore; On-site; SGD 55,000 - 75,000; Full time

Job summary

RF360 SINGAPORE PTE. LTD. is seeking a hands-on Process Engineer to support backend semiconductor packaging operations, focusing on wafer bumping, singulation, grinding, and mounting. You will provide day-to-day engineering support to meet production goals.

The role emphasizes data-driven problem solving, continuous improvement, and close collaboration with production, equipment, quality, planning, and other teams in a fast-paced manufacturing environment.

Qualifications

• Bachelor’s degree in engineering or related discipline.
• 2+ years of experience as a Process Engineer in semiconductor backend manufacturing or assembly.
• Fresh graduates with strong technical aptitude may be considered.

Responsibilities

• Provide engineering support for backend packaging processes (wafer bumping, singulation, grinding, mounting).
• Support daily production to meet output and quality targets.
• Monitor process data to identify trends and improvement opportunities.
• Lead troubleshooting for process abnormalities, yield issues, and quality excursions.
• Drive corrective and preventive actions for chronic quality issues.
• Collaborate with cross-functional teams to ensure production readiness.

Skills

Data analysis

Problem-solving

Critical thinking

Communication

Collaboration

Planning

Organization

Pressure handling

Education

Bachelor’s Degree in Engineering

Tools

Microsoft PowerPoint

Microsoft Excel

Microsoft Word

Job description

Job Summary:

We are seeking a motivated and hands-on Process Engineer to support backend semiconductor packaging operations, with primary focus on wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting processes. The successful candidate will provide day-to-day engineering support to meet production output, product quality, efficiency, productivity, yield, cycle time, and safety requirements. This role is ideal for an engineer who enjoys data-driven problem solving, continuous improvement, and working closely with cross-functional teams in a fast-paced manufacturing environment.

Key Responsibilities:

Process Engineering & Manufacturing Support

• Provide engineering support for backend semiconductor packaging processes, including wafer bumping, wafer singulation, wafer grinding/backgrind, and wafer mounting.
• Support daily production activities to achieve output, quality, efficiency, productivity, yield, cycle time, and safety targets.
• Monitor and analyse process data to identify trends, risks, and improvement opportunities.
• Lead troubleshooting and problem-solving activities for process abnormalities, yield loss, quality excursions, and production issues.
• Drive permanent corrective and preventive actions to resolve chronic process and quality issues.
• Evaluate new products, materials, and processes during pilot runs and ensure process readiness for production release.
• Work closely with production, equipment, quality, planning, and cross-functional teams to ensure smooth manufacturing execution.

Documentation, Compliance & Audit Support

• Maintain and ensure the relevance of Work Instructions, Control Plans, FMEA, and Process Control documents.
• Prepare production lines and process documentation for internal and external audits.
• Support audit follow-up actions and ensure timely closure of findings.
• Promote compliance with safety, quality, and manufacturing standards.

Continuous Improvement

• Identify and implement improvement actions to enhance process stability, productivity, yield, and cost effectiveness.
• Apply statistical and quality tools such as SPC, MSA, and structured problem-solving methods where applicable.
• Participate in cross-functional initiatives to improve manufacturing robustness and operational excellence.

Qualifications:

• Bachelor’s Degree in Engineering, preferably in Mechanical, Materials, Chemical, Manufacturing, or a related discipline.
• Preferably at least 2 years of relevant working experience as a Process Engineer in semiconductor assembly or backend manufacturing.
• Fresh graduates with strong technical aptitude and interest in semiconductor manufacturing may also be considered.

Required Skills & Competencies:

• Strong data analysis, problem-solving, and critical thinking skills.
• Good communication and collaboration skills, with the ability to work effectively with cross-functional teams.
• Good planning, organization, and follow-up skills.
• Ability to work under pressure and demonstrate strong commitment to achieving production and quality goals.
• Proficiency in Microsoft PowerPoint, Excel, and Word.
• Knowledge of statistical and quality tools such as SPC and MSA is preferred.

Ideal Candidate Profile:

• A proactive team player who is hands-on, detail-oriented, and comfortable working in a dynamic manufacturing environment.