R&D Process Engineer

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking a hands-on Process Engineer to develop, optimize, and stabilize wafer/package separation techniques, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation.

You will drive readiness and implement customer-focused technical solutions toward production. The role demands design of experiments, robust data analysis, and close collaboration with R&D, Process Engineering, Equipment, Quality, and Operations to ensure successful

Qualifications

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
• 3–5 years hands-on experience in process engineering in semiconductor manufacturing
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Proficiency in preparing technical documentation and delivering presentations

Responsibilities

• Develop and qualify separation processes for multiple technologies (2.5D, Fan-In, Fan-Out, eBar)
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with R&D, Process Engineering, Equipment, Quality, and Operations to drive qualification and manufacturing readiness
• Support advanced packaging separation process development and qualification
• Improve yield, quality, process capability, and manufacturing robustness
• Drive process innovation aligned with customer programs and technology roadmaps
• Support customer technical requirements and timely resolution of process issues
• Conduct process characterization, data analysis, and technical risk assessment for robust scalable processes
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage

Skills

DOE

Process optimization

Root-cause analysis

Cross-functional collaboration

Education

Bachelor's degree in Engineering (Mechanical/Materials/Electronics)

Tools

JMP

Job description

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging.

Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key Job Accountabilities (Actual daily deliverables):

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies.
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP.
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment.
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis.
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness.
• Provide technical support for customer programs, including feasibility evaluation and issue resolution.
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness.
• Support advanced packaging separation process development andqualification.
• Improve yield, quality, process capability, and manufacturing robustness.
• Drive process innovation aligned with customer programs and technologyroadmaps.
• Support customer technical requirements and timely resolution of processissues.
• Conduct process characterization, data analysis, and technical risk assessment to establish robust and scalable processes.
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage.

Requirements

• Bachelor's degree in Engineering(Mechanical/Materials/Electronics)
• 3-5years of hands-on experience in process engineering in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration processes.
• Proficiency in preparing technical documentation and delivering presentations

All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.