Wafer Singulation & Dicing Process Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a process engineer to develop, optimize, and stabilize wafer/package separation processes such as Laser Grooving, Stealth Dicing, and Blade Dicing in advanced semiconductor packaging.

You will lead DOE studies, implement statistical tools (JMP), and drive yield improvements and robust solutions for production. The role requires 3-5 years in semiconductor process engineering, a mechanical/materials/electronics engineering degree, and ability to

Qualifications

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics).
• 3-5 years hands-on process engineering in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration.

Responsibilities

• Develop, optimize, and stabilize separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies.
• Lead DOE, process optimization, characterization, and continuous improvement using JMP.
• Perform hands-on setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment.
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis.
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support readiness.
• Provide technical support for customer programs and collaborate with R&D, Process Engineering, Equipment, Quality, and Operations.

Skills

DOE

Statistical analysis

JMP

Process engineering

Education

Engineering degree

Tools

Laser Grooving equipment

Stealth Dicing equipment

Blade Dicing equipment

Job description

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a process engineer to develop, optimize, and stabilize wafer/package separation processes such as Laser Grooving, Stealth Dicing, and Blade Dicing in advanced semiconductor packaging.

You will lead DOE studies, implement statistical tools (JMP), and drive yield improvements and robust solutions for production. The role requires 3-5 years in semiconductor process engineering, a mechanical/materials/electronics engineering degree, and ability to