R&D Process Engineer (Die-to-Wafer)

PEOPLE PROFILERS PTE. LTD.; Singapore; Sur place; SGD 60 000 - 90 000; Plein temps

Avantages offerts par ce poste

Competitive remuneration package

Comprehensive benefits

Résumé du poste

PEOPLE PROFILERS PTE. LTD. is seeking a qualified Semiconductor Process Engineer to support Flipchip and Underfill development and qualification for advanced packaging applications.

You will contribute to improvements in yield, quality, and process robustness, while supporting customer programs, NPI and technology transfer. The role involves developing, optimizing, and qualifying Die-to-Wafer processes for advanced packaging, ensuring readiness and robust processes across development to

Qualifications

• Bachelor's degree in Engineering or related field required.
• 3–5 years hands-on semiconductor process engineering experience preferred.
• Experience with Die-to-Wafer, Flip Chip, Underfill or advanced packaging is advantageous.
• Strong analytical and problem-solving abilities required.
• Good communication and cross-functional collaboration skills.
• Ability to manage multiple activities in a fast-paced environment.

Responsabilités

• Support Flipchip and Underfill process development and qualification.
• Improve process yield, quality, capability and manufacturing robustness.
• Support customer programs, NPI and technology transfer.
• Develop, optimize and qualify D2W processes for advanced packaging.
• Ensure process readiness, yield improvements and robustness for customer solutions.
• Establish and maintain R&D flows, recipes and MES data for qualification builds.

Connaissances

Semiconductor process engineering

Die-to-Wafer

Flip Chip

Underfill

Problem solving

Communication

Cross-functional teamwork

Independent work

Formation

Bachelor's degree in Engineering

Outils

MES

Description du poste

Support Flipchip and Underfill process development and qualification for advanced packaging applications.

Contribute to improvements in process yield, quality, process capability, and manufacturing robustness.

Support customer programs, NPI and technology transfer.

Develop, optimize, and qualify Die-to-Wafer (D2W) processes, including Flipchip and Underfill, for advanced semiconductor packaging applications.

Support process readiness, yield improvement, process robustness, and customer-specific technical solutions from development through NPI.

Establish and maintain R&D process flows, recipes, instructions, and device information in MES to support engineering and qualification builds.

Requirements

• Bachelor's degree in Engineering (Mechanical, Materials, Electronics, or related disciplines).
• 3-5 years of hands-on semiconductor process engineering experience preferred.
• Experience in Die-to-Wafer, Flip Chip, Underfill, die attach, or advanced packaging processes is an advantage.
• Strong problem-solving and analytical skills.
• Good communication skills with the ability to work effectively with cross-functional teams.
• Ability to work independently and manage multiple engineering activities in a fast-paced semiconductor environment.

JOB ID: JOB-JK30102006A

20 Cecil Street, #08-09, Plus Building, Singapore 049705

• All Successful candidates can expect avery competitive remuneration package and a comprehensive range of benefits.