R&D Process Engineer

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED is seeking an experienced R&D Process Engineer specializing in optocoupler products.

You will design packaging processes, evaluate materials, and lead DOE studies to optimize manufacturing yield and reliability. Collaborate with IC designers, product engineers, and contract manufacturers to move devices from verification to high-volume soft launches, while applying SolidWorks, Ansys, CAD, and vision inspection tools to ensure robust packaging

Qualifications

• Experience in mechanical engineering and semiconductor packaging process development.
• Hands-on experience with Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form.
• Knowledge of high-voltage isolation requirements and materials.
• Experience leading NPI projects from verification to high-volume launch.
• Proficiency in SolidWorks/Ansys and CAD/simulation tools.
• Strong analytical and problem-solving mindset.

Responsibilities

• Design and implement packaging processes for new isolation products.
• Evaluate materials, properties, and processing methods; explore new techniques.
• Conduct DOE and optimize new processes.
• Collaborate with IC designers, engineers, and contract manufacturers to validate devices.
• Perform process yield analysis and investigate device-related failures.
• Plan and execute programs to reduce costs and boost yield, quality, and reliability.

Skills

Mechanical Engineering

Semiconductor Packaging

Process Development

NPI Project Management

Analytical Skills

Leadframe Design Tools

Failure Analysis Knowledge

CAD/Simulation Tools

Education

Bachelor's degree in Mechanical Engineering

Tools

SolidWorks

Ansys

CAD

Vision Inspection Tools

Job description

• Responsible for the design and implementation of packaging processes for new isolation products.

• Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.

• Conduct Design of Experiments (DOE) and optimize newly developed processes.

• Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.

• Perform process yield analysis and failure investigations for new device-related issues.

• Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

• We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.

• Strong background in Mechanical Engineering and semiconductor packaging process development.

• Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.

• Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.

• Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.

• Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.

• Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.

• Experience in Solidworks/ Ansys, CAD and simulation tools