R&D Singulation/Dicing Process Engineer

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 90,000 - 130,000; Full time

Job summary

STATS CHIPPAC MANAGEMENT PTE. LTD. is seeking a process engineer to develop, optimize, and stabilize wafer/package separation processes such as Laser Grooving, Stealth Dicing, and Blade Dicing in advanced semiconductor packaging.

You will lead DOE studies, implement statistical tools (JMP), and drive yield improvements and robust solutions for production. The role requires 3-5 years in semiconductor process engineering, a mechanical/materials/electronics engineering degree, and ability to

Qualifications

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics).
• 3-5 years hands-on process engineering in semiconductor manufacturing.
• Fundamental understanding of advanced semiconductor fabrication and integration.

Responsibilities

• Develop, optimize, and stabilize separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies.
• Lead DOE, process optimization, characterization, and continuous improvement using JMP.
• Perform hands-on setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment.
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis.
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support readiness.
• Provide technical support for customer programs and collaborate with R&D, Process Engineering, Equipment, Quality, and Operations.

Skills

DOE

Statistical analysis

JMP

Process engineering

Education

Engineering degree

Tools

Laser Grooving equipment

Stealth Dicing equipment

Blade Dicing equipment

Job description

About the role

Develop, optimize, and stabilize wafer/package separation processes, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation, for advanced semiconductor packaging. Drive process readiness, yield improvement, robustness, and customer-specific technical solutions toward production.

Key responsibilities

• Develop and qualify separation processes for 2.5D, Fan-In, Fan-Out, and eBar technologies
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools such as JMP
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support LVM readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with cross-functional teams including R&D, Process Engineering, Equipment, Quality, and Operations to drive process qualification, technology transfer, and manufacturing readiness

About you

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
• 3-5 years of hands-on experience in process engineering in semiconductor manufacturing
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Proficiency in preparing technical documentation and delivering presentations
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage