R&D Process Engineer

Avago Technologies Intl' Sales Pte Ltd; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Avago Technologies Intl' Sales Pte Ltd is seeking an experienced R&D Process Engineer specializing in optocoupler packaging. You will design and implement packaging processes for new isolation products, collaborating with IC designers, product engineers and contract manufacturers to develop validated device processes.

The role requires hands-on expertise in die attach, wire bonding, encapsulation, trim and form, vision inspection, and experience with SolidWorks/ Ansys.

Qualifications

• Experience in optocoupler packaging design and development.
• Strong background in semiconductor packaging processes.
• Hands-on experience with die attach, wire bonding, encapsulation and molding.
• Familiarity with mechanical leadframe design rules/tools and failure analysis.
• Experience leading NPI projects from verification to soft launch.

Responsibilities

• Design and implement packaging processes for new isolation products.
• Evaluate material reliability and processing techniques; explore new methods.
• Conduct design of experiments and optimize processes.
• Collaborate with IC designers, engineers, and contract manufacturers to validate device processes.
• Perform process yield analysis and investigate failures.
• Plan and execute programs to reduce costs and improve yield, quality, and reliability.

Skills

Analytical thinking

Problem solving

NPI experience

Team collaboration

Education

Bachelor's in Mechanical Engineering

Tools

Die Attach

Wire Bonding

Encapsulation/Molding

Package Trim & Form

Vision Inspection

SolidWorks

Ansys

Job description

• Responsible for the design and implementation of packaging processes for new isolation products.

• Evaluate material reliability, material properties, and processing techniques, while exploring new production methodologies for manufacturing.

• Conduct Design of Experiments (DOE) and optimize newly developed processes.

• Collaborate with IC designers, product engineers, manufacturing teams, support functions, and contract manufacturers to develop and validate new device processes through R&D programs.

• Perform process yield analysis and failure investigations for new device-related issues.

• Plan and execute engineering programs to achieve cost reduction targets and drive breakthrough improvements in manufacturing yield, quality, and reliability.

Requirement:

• We are seeking an experienced R&D Process Engineer specializing in Optocoupler products.

• Strong background in Mechanical Engineering and semiconductor packaging process development.

• Hands-on experience in processes such as Die Attach, Wire Bonding, Encapsulation/Molding, Package Trim & Form, and Vision Inspection tools.

• Demonstrated analytical and critical thinking skills with strong problem-solving capabilities and a solution-oriented mindset.

• Familiarity with mechanical leadframe design rules/tools and knowledge of semiconductor physical failure analysis.

• Experience in IC packaging, high-voltage isolation requirements, materials, and processing techniques.

• Experience leading NPI projects and taking products from verification/qualification through high-volume soft launch is an advantage.

• Experience in Solidworks/ Ansys, CAD and simulation tools