Wafer Singulation Process Engineer - Advanced Packaging

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking a hands-on Process Engineer to develop, optimize, and stabilize wafer/package separation techniques, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation.

You will drive readiness and implement customer-focused technical solutions toward production. The role demands design of experiments, robust data analysis, and close collaboration with R&D, Process Engineering, Equipment, Quality, and Operations to ensure successful

Qualifications

• Bachelor's degree in Engineering (Mechanical/Materials/Electronics)
• 3–5 years hands-on experience in process engineering in semiconductor manufacturing
• Fundamental understanding of advanced semiconductor fabrication and integration processes
• Proficiency in preparing technical documentation and delivering presentations

Responsibilities

• Develop and qualify separation processes for multiple technologies (2.5D, Fan-In, Fan-Out, eBar)
• Lead DOE, process optimization, characterization, and continuous improvement using statistical tools
• Perform hands-on process setup and optimization of Laser Groove, Stealth Dicing, and Blade Dicing equipment
• Drive process validation, yield stabilization, troubleshooting, and root-cause analysis
• Develop/review FMEA, OCAP, and Control Plans to mitigate process risks and support readiness
• Provide technical support for customer programs, including feasibility evaluation and issue resolution
• Collaborate with R&D, Process Engineering, Equipment, Quality, and Operations to drive qualification and manufacturing readiness
• Support advanced packaging separation process development and qualification
• Improve yield, quality, process capability, and manufacturing robustness
• Drive process innovation aligned with customer programs and technology roadmaps
• Support customer technical requirements and timely resolution of process issues
• Conduct process characterization, data analysis, and technical risk assessment for robust scalable processes
• Experience in Si Photonics applications, backgrinding, CMP, and planarization is an added advantage

Skills

DOE

Process optimization

Root-cause analysis

Cross-functional collaboration

Education

Bachelor's degree in Engineering (Mechanical/Materials/Electronics)

Tools

JMP

Job description

PEOPLE PROFILERS PTE. LTD. is seeking a hands-on Process Engineer to develop, optimize, and stabilize wafer/package separation techniques, including Laser Grooving, Stealth Dicing, Blade Dicing, and Molded Wafer Singulation.

You will drive readiness and implement customer-focused technical solutions toward production. The role demands design of experiments, robust data analysis, and close collaboration with R&D, Process Engineering, Equipment, Quality, and Operations to ensure successful