Process Engineer - Semiconductor Equipment

Manpower Staffing Services (Singapore) Pte Ltd; Singapore; On-site; SGD 85,000 - 120,000; Full time

Job summary

Manpower Staffing Services (Singapore) Pte Ltd seeks a skilled Process Engineer to develop and optimize hybrid bonding processes on state-of-the-art semiconductor equipment platforms. You will conduct DOE experiments, analyze data, and drive yield improvements while defining fresh process flows for client projects in advanced packaging.

Based in Singapore, this role offers exposure to equipment technology, application engineering, and close collaboration with engineering and field teams to

Qualifications

• Master's degree in Mechanical, Electrical, Electronics, Physics or related Engineering.
• Strong semiconductor process engineering background with experience in manufacturing.
• Experience in DOE, yield improvement, and process optimization.
• Familiarity with JMP or MATLAB is advantageous.

Responsibilities

• Develop and optimize D2W hybrid bonding processes to improve yield and process capability.
• Plan and execute DOE, process experiments, and data analysis.
• Define new process flows and evaluate customer feasibility.
• Optimize hybrid bonding and annealing processes.
• Prepare SOPs, technical documentation, and Best Known Methods (BKM).
• Support machine setup, customer demonstrations, and application development.
• Troubleshoot process-related issues and work with engineering and field support teams.

Skills

Semiconductor process engineering

DOE

Process development

Yield improvement

Data analysis

Education

Master's degree in Mechanical/Electrical/Electronics/Physics or related Engineering

Tools

JMP

MATLAB

Job description

Unlike a typical wafer fab Process Engineer role, this position focuses on advanced semiconductor equipment and process development. You will work on developing and optimizing hybrid bonding processes on client’s cutting-edge equipment platforms, conducting process experiments, improving yield, defining new process flows, and supporting customer process development. It is an excellent opportunity to move beyond production sustaining into equipment technology, application engineering, and next-generation advanced packaging.

Key Responsibilities:

• Develop and optimize D2W hybrid bonding processes to improve yield and process capability.
• Plan and execute DOE, process experiments, and data analysis.
• Define new process flows and evaluate customer feasibility.
• Optimize hybrid bonding and annealing processes.
• Prepare SOPs, technical documentation, and Best Known Methods (BKM).
• Support machine setup, customer demonstrations, and application development.
• Troubleshoot process-related issues and work closely with engineering and field support teams.

Requirements:

• Master's in Mechanical, Electrical, Electronics, Physics, or related Engineering disciplines.
• Excellent semiconductor process engineering background.
• Experience in process development, DOE, yield improvement, and process optimization.
• Exposure to front-end or back-end semiconductor manufacturing.
• Familiarity with data analysis tools such as JMP or MATLAB is advantageous.