PROCESS ENGINEER (WIREBOND)

Smartflex Technology Pte Ltd; Singapore; On-site; SGD 54,000 - 90,000; Full time

Job summary

Smartflex Technology Pte Ltd in Singapore is seeking a skilled Wire Bond Engineer to develop and enhance wire bonding processes (gold, silver, copper) ensuring quality and compliance with specifications. You will perform failure analysis, coordinate NPIs, qualify new products and materials, and collaborate with purchasing and engineering to source and qualify equipment.

The role demands hands-on maintenance of assembly and test machinery, SOP development, and participation in audits, while

Qualifications

• Degree or Diploma in Engineering (electronic or material science preferred).
• Minimum 3 years in manufacturing, preferably in semiconductor assembly/test.
• Working knowledge of bonding wires (gold, silver, copper), encapsulant epoxy, and substrates.
• Experience operating ESEC, ASM, and KNS wire bonders with Gold, Silver, and Copper wires.
• Experience in IC assembly processes (die attach, wire bond, encapsulation, testing).
• Experience maintaining die attach, wire bond, encapsulation, and testing machinery.
• Ability to multi-task in a fast-paced environment.
• Good teamwork, independence, initiative and communication skills.
• Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC.

Responsibilities

• Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
• Ensure wire bonding process meets customer’s specifications and requirements
• Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
• Co-ordinate NPI and NPQ activities to meet given timeline
• Qualify new product, material, device, and machinery
• Participate in new tape development, and new material development activities
• Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
• Benchmark new materials and new equipment technology in the market
• Train co-workers on new process implementation and new machinery operations
• Maintain, troubleshoot, and perform minor repair of assembly and test machinery
• Develop new and update existing Standard Operating Procedures
• Participate in internal audits, customers’ audits and external audits
• Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Skills

Teamwork

Communication

Problem solving

Initiative

Multitasking

Education

Engineering degree or diploma

Tools

ESEC wire bonder

ASM wire bonder

KNS wire bonder

Job description

Job Description:

• Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality


• Ensure wire bonding process meets customer’s specifications and requirements


• Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure


• Co-ordinate NPI and NPQ activities to meet given timeline


• Qualify new product, material, device, and machinery


• Participate in new tape development, and new material development activities


• Perform supplier sourcing and qualification activities jointly with purchasing and engineering team


• Benchmark new materials and new equipment technology in the market


• Train co-workers on new process implementation and new machinery operations


• Maintain, troubleshoot, and perform minor repair of assembly and test machinery


• Develop new and update existing Standard Operating Procedures


• Participate in internal audits, customers’ audits and external audits


• Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Job Requirements:

• Degree or Diploma in Engineering (preferably in electronic or material Science)


• Minimum 3 years working experience in a manufacturing environment (preferably in Semi-con assembly and test environment)


• Must have working knowledge and experience in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.


• Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires


• Experience in IC assembly processes such as die attach, wire bond, encapsulation, and testing


• Experience in maintenance of die attach, wire bond, encapsulation, and testing machinery


• Able to multi-tasks and work in a fast-paced environment,


• Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives


• Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC


• Good in problem solving, excellent interpersonal and communication skill