Senior Wire Bonding Process Engineer - NPI & Production

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking a professional to develop, qualify, and sustain wire bonding processes for semiconductor assembly from NPI through mass production.

Responsibilities include developing and optimizing KNS wire bonding processes, leading NPI and ramp-up activities, providing hands-on troubleshooting, and collaborating with Production, Equipment, Quality, Product Engineering, Materials, and NPI teams to ensure quality and efficiency.

Qualifications

• Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing, or a related discipline.
• Experience in semiconductor assembly, wire bonding, or backend manufacturing preferred.
• Hands-on experience with wire KNS bonding equipment.
• Good understanding of wire bonding processes, equipment, materials, capillaries, leadframes.
• Experience in NPI, process qualification, DOE, SPC, FMEA, and root cause analysis.

Responsibilities

• Develop and optimize KNS wire bonding processes, including recipes and bonding parameters.
• Lead NPI, process characterization, DOE, qualification, and ramp-up activities.
• Troubleshoot production issues and sustain wire bonding processes and equipment.
• Collaborate with Production, Equipment, Quality, Product Engineering, Materials, NPI teams.
• Support SPC, OOC/OOS investigations, FMEA and bond testing.
• Evaluate wires, capillaries, leadframes, substrates, and bonding technologies (Au, Cu, Ag, Pd wires).
• Prepare process specifications, control plans, instructions, reports, and presentations.

Skills

Wire bonding process troubleshooting

DOE / Design of Experiments

Statistical analysis (SPC)

Root cause analysis

Cross-functional collaboration

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing, or related discipline

Tools

KNS wire bonding equipment

Job description

PEOPLE PROFILERS PTE. LTD. is seeking a professional to develop, qualify, and sustain wire bonding processes for semiconductor assembly from NPI through mass production.

Responsibilities include developing and optimizing KNS wire bonding processes, leading NPI and ramp-up activities, providing hands-on troubleshooting, and collaborating with Production, Equipment, Quality, Product Engineering, Materials, and NPI teams to ensure quality and efficiency.