Engineer (Bond Equipment)

Vanguard International Semiconductor Corporation; Singapore; On-site; SGD 60,000 - 100,000; Full time

Job summary

Vanguard International Semiconductor Corporation is seeking an Equipment Owner for wafer bonding equipment in the Photo Department. The role ensures optimal tool performance, reliability, and process capability while evaluating upgrades and cost-effective solutions.

The successful candidate will oversee installation, qualification, modifications, and maintenance of wafer bonders and related production equipment, and partner with vendors to meet KPIs such as MTTR, MTBF, and OEE.

Qualifications

• Bachelor's degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering or related field.
• 2+ years semiconductor equipment or process engineering experience, preferably Lithography/Photo, Advanced Packaging, or Wafer Bonding.

Responsibilities

• Serve as the Equipment Owner for wafer bonding equipment within the Photo Department.
• Evaluate, select, and justify equipment upgrades and solutions.
• Oversee installation, qualification, modification, upgrades, and maintenance of wafer bonders and related equipment.
• Partner with vendors to resolve technical issues and manage KPIs (MTTR, MTBF, OEE, uptime).
• Lead projects on capacity expansion, yield improvement, defect reduction, cost savings, and equipment optimization.
• Review SPC and FDC data to identify trends and implement corrective actions.
• Provide technical support to manufacturing, maintenance, and process engineering teams.
• Develop and improve preventive and predictive maintenance procedures and schedules.
• Conduct technical training for operators, technicians, and engineers.

Skills

Equipment ownership

Troubleshooting

Project management

Analytical thinking

Communication

Education

Bachelor's degree in Electrical/Electronics/Mechanical/Mechatronics/Microelectronics Engineering

Tools

Wafer Bonders

Gemini Bonders

SAM Coat

Job description

• Serve as the Equipment Owner for wafer bonding equipment within the Photo Department, ensuring optimal tool performance, reliability, and process capability.
• Evaluate, select, and justify equipment, upgrades, and solutions that are cost-effective and aligned with photonics manufacturing requirements.
• Oversee installation, qualification, modification, upgrades, and maintenance of wafer bonders, Gemini bonders, and related production equipment.
• Partner with equipment vendors to resolve technical issues and manage vendor performance to meet or exceed equipment KPIs, including MTTR, MTBF, OEE, and uptime targets.
• Establish and execute projects focused on capacity expansion, yield improvement, defect reduction, cost savings, and equipment optimization.
• Review and analyze SPC data, equipment performance metrics, and Fault Detection & Classification (FDC) data to identify trends and implement effective corrective actions.
• Provide technical support to manufacturing, maintenance, and process engineering teams to ensure stable production operations.
• Develop, maintain, and continuously improve preventive and predictive maintenance procedures, schedules, and documentation.
• Conduct technical training for operators, technicians, and engineers on equipment operation, maintenance, troubleshooting, and best practices.
• Mentor and coach shift engineers in systematic hardware troubleshooting, root cause analysis, and the development of troubleshooting guides, OCAPs, and lesson-learned documentation.
• Provide technical support to manufacturing, maintenance, and process engineering teams to ensure stable production operations.
• Develop, maintain, and continuously improve preventive and predictive maintenance procedures, schedules, and documentation.

Job Requirements:

• Bachelor's Degree in Electrical, Electronics, Mechanical, Mechatronics, Microelectronics Engineering, or related Engineering discipline.
• Minimum 2 years of semiconductor equipment or process engineering experience, preferably in Lithography/Photo, Advanced Packaging, or Wafer Bonding operations.
• Hands-on experience with Wafer Bonders, Gemini Bonders, SAM Coat equipment.
• Strong knowledge of equipment troubleshooting, process optimization, equipment qualification, and production support in a high-volume manufacturing environment.
• Experience in developing, implementing, and sustaining preventive and predictive maintenance strategies to maximize equipment uptime and performance.
• Ability to execute equipment upgrades, hardware modifications, and continuous improvement projects to enhance reliability, capability, and operational efficiency.
• Strong analytical and logical thinking skills with a proven track record of driving effective problem resolution.
• Excellent communication, interpersonal, and stakeholder management skills.
• Willing to work Normal Shift, Swing Shift, or 12-hour rotating shift when required.

We regret that only shortlisted candidates will be notified.