Process Engineer (Wire Bond)

GMP TECHNOLOGIES (S) PTE LTD; Singapore; On-site; SGD 42,000 - 66,000; Full time

Job summary

GMP Technologies (S) Pte Ltd in Singapore seeks a skilled materials/electronics engineer to develop and optimize wire bonding processes (gold, silver, copper). You will ensure the process capability meets customer specifications and participate in NPI/NPQ activities.

Responsibilities include failure analysis, SOP updates, audits, supplier qualification, training, and maintaining equipment. Requires 2–3 years in semiconductor assembly/test and knowledge of FMEA, ISO9001/QMS standards.

Qualifications

• Degree or Diploma in Material Science / Electronics Engineering.
• 2-3 years in a manufacturing environment (preferably Semiconductor assembly/test).
• Experience operating ESEC, ASM, KNS wire bonders using gold, silver, and copper wires.
• Knowledge of bonding wire materials (gold, silver, copper), encapsulant epoxy, substrates.
• Module knowledge in IC assembly processes (die attach, wire bond, encapsulation, testing).
• Good team player, independent, resourceful, proactive.

Responsibilities

• Develop new and improve wire bonding processes for capability, stability, and quality.
• Ensure wire bonding processes meet customer specifications.
• Conduct failure analysis to identify root causes and prevent recurrence.
• Coordinate NPI/NPQ activities to meet timelines.
• Qualify new products, materials, devices, and machinery.
• Participate in new tape/material development activities.
• Perform supplier sourcing and qualification with purchasing/engineering.
• Benchmark new materials and equipment technology.
• Train co-workers on new processes and machinery operations.
• Maintain, troubleshoot, and repair assembly & test machinery.
• Develop/update Standard Operating Procedures.
• Participate in internal, customer, and external audits.
• Comply with quality, environmental, health, safety, and security policies.

Skills

Wire bonding

Troubleshooting

Team player

Initiative

Education

Material Science degree

Electronics Engineering diploma

Tools

ESEC wire bonder

ASM wire bonder

KNS wire bonder

Job description

Responsibilities

• Develop new and improve existing gold, silver, and copper wire bonding process capability, stability, and quality
• Ensure wire bonding process meets customer's specifications and requirements
• Conduct failure analysis to identity root cause of wire bonding failures and find solutions to prevent future failure
• Co-ordinate NPI and NPQ activities to meet given timeline
• Qualify new product, material, device, and machinery
• Participate in new tape development, and new material development activities
• Perform supplier sourcing and qualification activities jointly with purchasing and engineering team
• Benchmark new materials and new equipment technology in the market
• Train co-workers on new process implementation and new machinery operations
• Maintain, troubleshoot, and perform minor repair of assembly and test machinery
• Develop new and update existing Standard Operating Procedures
• Participate in internal audits, customers' audits and external audits
• Comply with all quality, environmental, health, safety, and security policies and procedures of the Company

Requirements

• Degree or Diploma in Material Science / Electronics Engineering
• Minimum 2-3 years working experience in a manufacturing environment (preferably in Semiconductor assembly and test environment / OSAT)
• Experience in operating ESEC, ASM, KNS wire bonders using Gold, Silver, and Copper wires
• Knowledgeable in the material science of bonding wires (gold, silver, copper), encapsulant epoxy, and structural substrates.
• Module knowledge in IC assembly processes such as die attach, wire bond, encapsulation, and testing
• Good team player, able to work independently, resourceful, willing to learn new skills, and has initiatives
• Knowledge in FMEA, SPC, OCAP, DOE, ISO9001:2000, ISO14001:2004, QEMS, CQM, JEDEC
• Good in problem solving, excellent interpersonal and communication skill

GMP Technologies (S) Pte Ltd | EA License 11C3793 | EA Personnel: Novita Widjaja | Registration No: R22105960