Wire Bond-Manufacturing Engineer

Lumilens; Singapore; On-site; SGD 70,000 - 110,000; Full time

Benefits offered by this job

Competitive salary and benefits

Cutting-edge packaging technology

Collaborative engineering environment

Career growth in engineering track

Job summary

Lumilens in Singapore is seeking a mid-to-senior Wire Bond Manufacturing Engineer to develop, qualify, and optimize wire bond processes for gold, copper, and aluminum wires in semiconductor packaging.

You will own process and equipment performance, lead CAPA, support NPI, and collaborate across product, design, QA, and suppliers to deliver high yield and reliability.

Qualifications

• Bachelor's degree in Electrical, Mechanical, Materials Science, or related engineering.
• 3–7 years’ hands-on experience in wire bond process/equipment engineering within semiconductor assembly.
• Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes.
• Experience with DOE, SPC, and root cause/CAPA methods.
• Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond).
• Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883).
• Strong analytical, troubleshooting, and cross-functional communication skills.
• Willingness to support shift or production floor needs.

Responsibilities

• Develop, qualify, and optimize wire bond processes (gold, copper, aluminum) for various bonding methods.
• Establish and maintain process specifications, bond recipes, work instructions, and control plans.
• Lead root cause analysis and CAPA for yield losses and defects.
• Support NPI by developing new wire bond process flows, including DOE-driven windows.
• Perform wire pull and ball shear testing; analyze results against MIL-STD-883/JEDEC specs.
• Drive process capability improvements and defect reduction through SPC and problem solving.
• Own uptime, throughput, and performance of wire bonding equipment.

Skills

Wire bond processes

DOE / DOE-driven

SPC

CAPA

Cross-functional communication

Analytical troubleshooting

Shift work willingness

Education

Bachelor's degree in Electrical, Mechanical, Materials Science, or related engineering

Tools

ASM / Kulicke & Soffa

Shinkawa equipment

West Bond systems

AOI / vision systems

Minitab / JMP

Job description

About Lumilens

At Lumilens, we are building the critical photonics infrastructure powering tomorrow’s AI supercomputing. Our mission is to unlock a new era of computing that is faster, cooler, and massively more efficient. Join our world-class team as we redefine possibilities in photonic technology.

Job Description

We are seeking a Wire Bond Manufacturing Engineer specializing in Process & Equipment to join our Manufacturing Engineering team within Semiconductor Assembly & Test. In this mid-to-senior level role, you will be responsible for developing, qualifying, optimizing, and sustaining wire bonding processes and equipment for semiconductor packaging operations. You will oversee process and equipment performance for ball bonding, wedge bonding, and ribbon bonding operations, ensuring high yield, reliability, and throughput, while driving continuous improvement and supporting new product introduction (NPI).

Key Responsibilities

Process Engineering

• Develop, characterize, qualify, and optimize wire bond processes (thermosonic ball bonding, wedge bonding, ribbon bonding) for gold, copper, and aluminum wire systems

• Establish and maintain process specifications, bond recipes, work instructions, and control plans

• Lead root cause analysis and corrective/preventive actions (CAPA) for wire bond process yield losses and defects

• Support NPI by developing new wire bond process flows, including DOE-driven process windows

• Perform wire pull and ball shear testing; analyze results against specifications (MIL-STD-883, JEDEC)

• Drive process capability (Cpk) improvements and defect reduction through SPC and structured problem-solving

Equipment Engineering

• Own the uptime, throughput, and performance of wire bonding equipment (ASM, Kulicke & Soffa, Shinkawa, Hesse, etc.)

• Troubleshoot and resolve equipment-related issues and optimize bonder cycle time and UPH (units per hour)

• Lead equipment qualification, installation, and buy-off (IQ/OQ/PQ) for new or upgraded wire bonders

• Collaborate with equipment vendors for technical escalations and upgrades

• Plan preventive maintenance and spare parts strategy

Quality & Reliability

• Partner with Quality and Reliability teams on failure analysis for field and customer returns

• Support qualification builds, reliability testing (temp cycle, HTOL, HAST), and customer PPAP/PSW submissions

• Ensure compliance with IPC/JEDEC standards and customer requirements

Cross-Functional Collaboration

• Work closely with Product/Design Engineering for bond pad layout and substrate design

• Partner with Process Integration, Test, and Quality to resolve yield and reliability issues

• Support cost reduction initiatives and train operators/technicians on process and equipment

Documentation & Compliance

• Maintain process control documents, FMEAs, control plans, and traceability as per Lumilens quality management systems (ISO 9001 / IATF 16949 / AS9100)

• Support internal and customer audits related to wire bond processes and equipment

Requirements

Required:

• Bachelor’s degree in Electrical, Mechanical, Materials Science, or related engineering

• 3–7 years’ hands‑on experience in wire bond process/equipment engineering within semiconductor assembly (OSAT/IDM)

• Knowledge of ball, wedge, and/or ribbon bonding processes and failure modes

• Experience with DOE, SPC, and root cause/CAPA methods

• Familiarity with wire bond equipment platforms (ASM, Kulicke & Soffa, Shinkawa, Hesse, West Bond)

• Understanding of reliability tests and industry standards (JEDEC, MIL-STD-883)

• Strong analytical, troubleshooting, and cross‑functional communication skills

• Willingness to support shift or production floor needs

Preferred:

• Experience in high-volume power semiconductor, RF/microwave, automotive, or optoelectronics packaging

• Exposure to copper wire bonding and associated process/reliability considerations

• Experience with fine‑pitch wire bonding (<50 µm) and multi-tier/stacked die bonding

• Six Sigma Green/Black Belt certification

• Familiarity with statistical software (Minitab, JMP), MES/data systems, and AOI/vision systems

• Cleanroom manufacturing experience

What We Offer

• Competitive salary and benefits package

• The opportunity to work on cutting‑edge semiconductor packaging technology

• A collaborative, cross‑functional engineering environment

• Career growth within the manufacturing/process engineering track

Lumilens is an equal opportunity employer committed to diversity and inclusion.