Semicon Wirebond Development Senior /Engineer

PEOPLE PROFILERS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

PEOPLE PROFILERS PTE. LTD. is seeking a professional to develop, qualify, and sustain wire bonding processes for semiconductor assembly from NPI through mass production.

Responsibilities include developing and optimizing KNS wire bonding processes, leading NPI and ramp-up activities, providing hands-on troubleshooting, and collaborating with Production, Equipment, Quality, Product Engineering, Materials, and NPI teams to ensure quality and efficiency.

Qualifications

• Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing, or a related discipline.
• Experience in semiconductor assembly, wire bonding, or backend manufacturing preferred.
• Hands-on experience with wire KNS bonding equipment.
• Good understanding of wire bonding processes, equipment, materials, capillaries, leadframes.
• Experience in NPI, process qualification, DOE, SPC, FMEA, and root cause analysis.

Responsibilities

• Develop and optimize KNS wire bonding processes, including recipes and bonding parameters.
• Lead NPI, process characterization, DOE, qualification, and ramp-up activities.
• Troubleshoot production issues and sustain wire bonding processes and equipment.
• Collaborate with Production, Equipment, Quality, Product Engineering, Materials, NPI teams.
• Support SPC, OOC/OOS investigations, FMEA and bond testing.
• Evaluate wires, capillaries, leadframes, substrates, and bonding technologies (Au, Cu, Ag, Pd wires).
• Prepare process specifications, control plans, instructions, reports, and presentations.

Skills

Wire bonding process troubleshooting

DOE / Design of Experiments

Statistical analysis (SPC)

Root cause analysis

Cross-functional collaboration

Education

Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing, or related discipline

Tools

KNS wire bonding equipment

Job description

The role focuses on developing, qualifying, and sustaining wire bonding processes for semiconductor assembly, from NPI through mass production.

Key responsibilities:

• Develop and optimize KNS wire bonding processes, including recipes, bonding parameters, loop profiles, and bond locations.
• Lead NPI, process characterization, DOE, process qualification, and production ramp-up activities.
• Provide hands-on production troubleshooting and sustaining support for wire bonding process and equipment issues.
• Work with Equipment Engineering on machine setup, preventive maintenance, qualification, installation, relocation, and machine-to-machine matching.
• Investigate wire bonding failures using 5-Why, Fishbone, DOE, statistical analysis, and failure-analysis techniques.
• Improve yield, UPH, process capability, equipment utilization, quality, and manufacturing efficiency.
• Support SPC, OOC/OOS investigations, FMEA, bond pull/shear testing, customer audits, and quality requirements.
• Evaluate and support different wires, capillaries, leadframes, substrates, and bonding technologies, including Au, Cu, Ag, and Pd-coated wires.
• Prepare process specifications, control plans, work instructions, qualification reports, and technical presentations.
• Collaborate closely with Production, Equipment, Quality, Product Engineering, Materials, NPI teams, and external suppliers.

Requirement:

• Bachelor's degree in Mechanical, Electrical, Electronics, Manufacturing, Materials Engineering, or a related discipline .
• Experience in semiconductor assembly, wire bonding, or backend manufacturing is preferred.
• Hands-on experience with wire KNS bonding equipment
• Good understanding of wire bonding processes, equipment, materials, capillaries, leadframes
• Experience in NPI, process qualification, DOE, SPC, FMEA, and root cause analysis .
• Strong troubleshooting and analytical skills with a hands-on approach to production problems.
• Good understanding of semiconductor assembly manufacturing processes and quality requirements.
• Strong communication and interpersonal skills with the ability to work effectively in a cross-functional environment.
• Able to work independently, manage multiple projects, and meet NPI and production support timelines.