Wire Bond Process Engineer — Quality & NPI Leader

GMP TECHNOLOGIES (S) PTE LTD

Singapore

On-site

SGD 42,000 - 66,000

Full time

11 days ago

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Job summary

GMP Technologies (S) Pte Ltd in Singapore seeks a skilled materials/electronics engineer to develop and optimize wire bonding processes (gold, silver, copper). You will ensure the process capability meets customer specifications and participate in NPI/NPQ activities.

Responsibilities include failure analysis, SOP updates, audits, supplier qualification, training, and maintaining equipment. Requires 2–3 years in semiconductor assembly/test and knowledge of FMEA, ISO9001/QMS standards.

Qualifications

Degree or Diploma in Material Science / Electronics Engineering.
2-3 years in a manufacturing environment (preferably Semiconductor assembly/test).
Experience operating ESEC, ASM, KNS wire bonders using gold, silver, and copper wires.
Knowledge of bonding wire materials (gold, silver, copper), encapsulant epoxy, substrates.
Module knowledge in IC assembly processes (die attach, wire bond, encapsulation, testing).
Good team player, independent, resourceful, proactive.

Responsibilities

Develop new and improve wire bonding processes for capability, stability, and quality.
Ensure wire bonding processes meet customer specifications.
Conduct failure analysis to identify root causes and prevent recurrence.
Coordinate NPI/NPQ activities to meet timelines.
Qualify new products, materials, devices, and machinery.
Participate in new tape/material development activities.
Perform supplier sourcing and qualification with purchasing/engineering.
Benchmark new materials and equipment technology.
Train co-workers on new processes and machinery operations.
Maintain, troubleshoot, and repair assembly & test machinery.
Develop/update Standard Operating Procedures.
Participate in internal, customer, and external audits.
Comply with quality, environmental, health, safety, and security policies.