Associate Engineer – Wire Bond Equipment

STATS CHIPPAC MANAGEMENT PTE. LTD.; Singapore; On-site; SGD 42,000 - 54,000; Full time

Job summary

STATS ChipPAC MANAGEMENT PTE. LTD. is seeking a hands-on Associate Engineer to support setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

You will work on machine setup, qualification, and conversion, while minimizing downtime through effective troubleshooting. Responsibilities include preventive and corrective maintenance, monitoring performance, and conducting root cause analysis.

Qualifications

• Diploma in Electrical, Electronics, Mechanical or Mechatronics required.
• Hands-on maintenance and troubleshooting experience with wire bond equipment.
• Willingness to rotate between day and night shifts.

Responsibilities

• Perform machine setup, qualification, and conversion for wire bond equipment.
• Troubleshoot and repair equipment to minimize production downtime.
• Conduct preventive and corrective maintenance activities.
• Monitor equipment performance and implement improvements.
• Support production during breakdowns and urgent technical issues.
• Perform root cause analysis and corrective actions.
• Maintain equipment documentation and spare parts records.

Skills

Troubleshooting

Problem-solving

Shift adaptability

Education

Electrical/Electronics/Mechanical/Mechatronics Diploma

Tools

KNS Maxum

iConn

Rapid Bonder

Job description

About us

STATS ChipPAC is a leading provider of semiconductor packaging and test services. We are committed to delivering innovative engineering solutions and maintaining excellence in manufacturing processes. Our team of skilled engineers and technicians work collaboratively to push the boundaries of what's possible in semiconductor technology, serving clients across diverse industries and markets worldwide.

About the role

We are seeking a motivated and hands-on Associate Engineer to support the setup, maintenance, troubleshooting, and repair of wire bond equipment in a semiconductor manufacturing environment.

Key responsibilities

• Perform machine setup, qualification, and conversion for wire bond equipment.
• Troubleshoot and repair equipment-related issues to minimize production downtime.
• Conduct preventive and corrective maintenance activities.
• Monitor equipment performance and implement improvement actions.
• Support production during machine breakdowns and urgent technical issues.
• Perform root cause analysis and corrective actions.
• Maintain equipment documentation and spare parts records.

What we're looking for

• Minimum Diploma in Electrical, Electronics, Mechanical, Mechatronics Engineering or related field.
• Minimum 2 years of hands-on experience in wire bond equipment maintenance and troubleshooting.
• Experience with KNS Maxum, iConn, or Rapid Bonder machines is preferred.
• Strong troubleshooting and problem-solving skills.
• Knowledge of semiconductor backend assembly processes is an advantage.
• Able to support 12-hour rotating shifts.
• Willing to work both Day Shift and Night Shift based on operational requirements.