Process Engineer

HERAEUS MATERIALS SINGAPORE PTE. LTD.; Singapore; On-site; SGD 67,000 - 89,000; Full time

Job summary

Heraeus Materials Singapore Pte. Ltd. is seeking a Process Engineer to sustain and optimize bonding wire manufacturing processes. You will troubleshoot production issues, drive continuous improvement, and support new product introductions to ensure quality, yield, and cost competitiveness.

You will lead cross-functional projects, monitor key process variables, and implement corrective actions. Experience with SPC, DOE, Six Sigma and data analysis is highly valued.

Qualifications

• Bachelor’s degree in engineering or related field.
• 2 years of relevant experience preferred.
• Knowledge of semiconductor interconnect and assembly materials is advantageous.
• Familiarity with statistical tools and problem-solving methodologies such as Six Sigma, DOE, and root cause analysis is desirable.

Responsibilities

• Lead or participate in metallurgical and materials engineering projects affecting bonding wire processes.
• Sustain and control existing manufacturing processes and investigate production issues.
• Support daily production activities including process control, equipment performance, QA, and shipment requirements.
• Monitor key process variables, analyze deviations, and implement CAPA actions.
• Collaborate with Manufacturing, Maintenance, NPI, and Quality Assurance to improve processes and update FMEA/Control Plan/SOPs.
• Drive yield, productivity, scrap reduction, and on-time delivery through continuous improvement initiatives.

Skills

Troubleshooting

Process improvement

Cross-functional collaboration

Data analysis

Education

Bachelor of Engineering (Mechanical/Chemical/Electrical & Electronics)

Tools

SPC

Minitab

JMP

Job description

This Process Engineer responsible for sustaining and optimizing manufacturing processes, troubleshooting production issues, driving continuous process improvements, supporting new product introductions, and ensuring product quality, yield, productivity, and cost competitiveness in bonding wire manufacturing operations.

Job Responsibilities:

• Lead or participate in metallurgical and materials engineering projects involving micro-alloyed castings, mechanical deformation, thermo-mechanical treatment, and bonding wire coating processes, including:
• Evaluation of new machines, products, processes, and raw materials
• Sustaining and controlling existing manufacturing processes
• Investigation and resolution of production issues and customer complaints
• Support daily bonding wire production activities related to process control, equipment performance, product characteristics, quality assurance, and shipment requirements. Monitor key process variables, analyze deviations and variations, and implement corrective & preventive actions.
• Authorized to place lots on hold, initiate rework activities, and recommend disposition actions in accordance with quality management procedures.
• Collaborate with cross-functional teams, including Manufacturing, Maintenance, NPI, and Quality Assurance, to develop and improve processes, procedures, workflows, and updating FMEA, Control Plan, SOP documentation.
• Drive continuous improvements in yield, productivity, scrap reduction, cost savings, MES implementation, and on-time delivery (OTD) performance. Monitor SPC/SQC metrics, initiate corrective and preventive actions (CAPA), and provide regular KPI reporting to management.
• Work with suppliers and external partners to support manufacturing processes, equipment development, automation initiatives, and Industry 4.0 transformation projects.
• Lead or participate in process control and technology improvement projects to enhance product quality, manufacturing efficiency, product performance, and cost competitiveness while identifying opportunities for process simplification and automation.

Job Requirement:

• Bachelor of Engineering, Mechanical Engineering, Chemical Engineering, Electrical & Electronics Engineering, Physics, or related engineering fields.
• 2 years of relevant experience is preferred.
• Knowledge in Semiconductor interconnect, assembly materials related knowledge and practical experience preferred.
• Knowledge in mechanical processing, material characterization is highly advantageous.
• Experience in resolving a manufacturing process and product issues indepedently.
• Strong troubleshooting and solving skills.
• Knowledge in statistical tools(SPC, Minitab/JMP) is prefered.
• Knowledge in Occupational Health and Safety (OHS) and Environmental Management System (EMS).
• Understanding of Six Sigma, Lean Manufacturing, FMEA, DOE, and root cause analysis methodologies is advantageous.