Principal Packaging Engineer: Data-Driven Integration

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 70,000 - 120,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd is seeking an engineer to develop and enable advanced package technology for post-fab wafer finish and assembly processes. You will drive yield improvements, reduce costs, and collaborate with process and product engineering teams to integrate semiconductors.

The role requires strong data analytics skills (Python/R/SQL), experience with SPC/DOE, and familiarity with E3/FDC/RMS for equipment and process control. A PhD is welcomed but not required.

Qualifications

• A degree in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Physics, or related fields.
• At least 2 years of semiconductor process integration experience.
• Proficiency in Python, R, SQL for analytics; experience with Visual Basic for automation and tool integration.

Responsibilities

• Develop and enable advanced package technology for post-fab wafer finish and assembly processes.
• Improve product quality, yield, cost, and productivity.
• Integrate semiconductors with process and product engineering teams.

Skills

Python

R

SQL

Visual Basic

Data analytics

SPC

DOE

Dashboarding

Education

B.S.

M.S.

Ph.D.

Tools

E3

FDC

RMS

Job description

1100 Micron SemiAsiaOP Pte Ltd is seeking an engineer to develop and enable advanced package technology for post-fab wafer finish and assembly processes. You will drive yield improvements, reduce costs, and collaborate with process and product engineering teams to integrate semiconductors.

The role requires strong data analytics skills (Python/R/SQL), experience with SPC/DOE, and familiarity with E3/FDC/RMS for equipment and process control. A PhD is welcomed but not required.