Senior Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering

Micron Technology; Singapore; On-site; SGD 70,000 - 100,000; Full time

Job summary

Micron Technology in Singapore is seeking a skilled professional to develop and optimize assembly processes for advanced packaging technologies in high-performance memory products. The role requires collaboration with various teams to ensure technology development aligns with business objectives.

The ideal candidate will have a degree in a related technical field and 2+ years of experience in semiconductor processes, along with proficiency in Python, R, and SQL. Focus on quality improvement and cost reduction is essential.

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Qualifications

• 2+ years of semiconductor process development experience, preferably in wafer bonding and packaging.
• Experience with Visual Basic for automation and tool integration.
• Strong understanding of process flows and how changes affect yield and reliability.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Collaborate with stakeholders to build and execute technology development strategies.

Skills

Proficiency in Python

Proficiency in R

Proficiency in SQL

Strong data analytics capabilities

Education

B.S., M.S., or Ph.D. in Materials Science or related fields

Tools

E3

FDC (Fault Detection and Classification)

RMS (Recipe Management System)

Job description

Overview

Micron’s Advanced Packaging Technology Development (APTD) is responsible for delivering package development for high performance memory products and transferring to manufacturing. The role focuses on developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability, and schedule requirements.

Key Responsibilities and Duties

• Process Development: Develop and optimize assembly processes for advanced packaging technologies, including wafer‑level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.
• Equipment and Materials: Evaluate and promote new equipment and materials to enhance process capabilities; set up process parameters for a variety of semiconductor equipment; evaluate, promote, and plan for new equipment and materials.
• Quality Improvement: Ensure defense coverage through process, measurement, inspection, and testing; establish correlations between defense mechanisms to identify improvement opportunities; conduct continuous data analysis to establish advanced controls and identify improvement opportunities.
• Collaboration and Coordination: Work closely with internal and external stakeholders to build and execute technology development strategies aligned with organizational and business objectives; work closely with various teams, including the Package Integration, Assembly Engineering, Front End Wafer Fab, Assembly/Test Engineering, Product Engineering, and Global Quality, to integrate manufacturing processes for optimal performance and quality control; ensure smooth transition from new product development, qualification, small volume production to high volume production; provide Process Of Record (POR) and Model Of Record (MOR) documentation for product transfer to production in high volume manufacturing fabrication facilities.

Requirements

• B.S., M.S., or Ph.D. (or equivalent) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or other related technical fields.
• 2 or more years of semiconductor process development or equipment evaluation in semiconductor, preferably in wafer bonding, die stacking, and packaging field.
• Proficiency in Python, R, SQL for statistical analysis, process modeling, and data analytics; experience with Visual Basic for automation and tool integration.
• Familiarity with E3, FDC (Fault Detection and Classification), and RMS (Recipe Management System) for equipment and process control.
• Strong data analytics capabilities to support SPC, DOE, defect analysis, and dashboarding.
• Strong understanding of process flows, process interactions, and how process changes can affect yield, performance, and reliability.
• Tenacity to work effectively under timelines and limited resources.
• Consistent track record to solve problems and address root causes.

EEO Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.