Lead Advanced Packaging TD Integrator

1100 Micron SemiAsiaOP Pte Ltd; Singapore; On-site; SGD 100,000 - 150,000; Full time

Job summary

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a highly qualified individual for the role focused on developing advanced packaging process solutions. Candidates should possess extensive experience in the semiconductor industry along with a suitable educational background in engineering fields.

The position will involve ensuring product quality and improving processes through innovative technologies, while also managing projects effectively in a collaborative environment.

Qualifications

• 10 years' or more experience in the semiconductor industry, preferably in R&D or technology development.
• Experience in Frontend fab Process integration or Module process.
• Ability to integrate & cooperate with people from cross‑function teams.

Responsibilities

• Develop advanced packaging process solutions for all advanced packaging products.
• Lead new Technode process readiness and improve yield, quality, and reliability.
• Ensure smooth transition from new process development to small volume production launch.

Skills

Failure analysis methodologies

DRAM/NAND technology

Project management

Data analytics platforms

Simulation tools

Strong communication skills

Education

PhD, Master’s or Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent

Tools

Simulation tools

Data analytics platforms

Job description

1100 Micron SemiAsiaOP Pte Ltd in Singapore is seeking a highly qualified individual for the role focused on developing advanced packaging process solutions. Candidates should possess extensive experience in the semiconductor industry along with a suitable educational background in engineering fields.

The position will involve ensuring product quality and improving processes through innovative technologies, while also managing projects effectively in a collaborative environment.