Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering

WhiteCrow Research; Singapore; On-site; SGD 90,000 - 150,000; Full time

Job summary

WhiteCrow Research is assisting a global semiconductor leader to fill a Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering role. You will develop advanced package technologies for post-fab wafer finish and assembly, and help drive manufacturing improvements.

You will collaborate with multiple engineering teams, analyze data, perform DOE and SPC, and ensure quality from development to high-volume manufacturing.

Qualifications

• BS/MS/PhD in engineering or related field as listed in HTML.
• 2+ years semiconductor process integration experience, preferably in advanced packaging.
• Proficient with Python, R, and SQL; experience with Visual Basic.
• Strong statistical analysis, DOE, SPC, and defect analysis skills.

Responsibilities

• Develop advanced package technologies for post-fab wafer finish and assembly.
• Improve product quality, yield, productivity, and manufacturing cost.
• Partner with process and product engineering teams to integrate semiconductor technologies.
• Drive yield improvements through package integration, layout optimization, and margin enhancement.
• Collect and analyze data to support design, layout, and integration decisions.
• Collaborate with Probe, Yield Analysis, Test, Product Engineering, and Quality teams.
• Ensure robust quality through monitoring, inspection, testing, SPC, DOE, and defect analysis.
• Support product transition from development through qualification into High Volume Manufacturing.
• Provide Process of Record (POR) and Model of Record (MOR) documentation.

Skills

Python

R

SQL

Visual Basic

Processes knowledge (E3)

FDC

RMS

Statistical analysis

Process modeling

SPC

DOE

Defect analysis

Dashboarding

Semiconductor process flows

Root-cause analysis

Problem solving

Education

B.S./M.S./Ph.D. in Electrical, Mechanical, Chemical Engineering, Physics, Materials Science, or related discipline

Tools

Visual Basic

Job description

We are global talent research, insight, and sourcing specialists with offices in the UK, USA, Singapore, Malaysia, Hong Kong, Dubai, and India. Our international reach has helped us to understand and penetrate specialist markets at a global level. In addition to this, our service is also extended to complement our client’s in-house talent acquisition teams.

About Our Client

Our client is a global technology leader specializing in advanced memory and storage solutions that power next-generation computing and data-driven applications. With strong expertise in semiconductor innovation, the organization develops high-performance memory technologies across DRAM, NAND, and storage platforms for applications spanning data centers, artificial intelligence, mobile devices, client computing, and intelligent edge ecosystems.

Driven by a commitment to technology advancement, operational excellence, and customer-centric innovation, the company plays a significant role in enabling modern digital infrastructure and compute-intensive workloads worldwide.

As a Principal/Senior Engineer, APTD CEM - Advanced Packaging Integration Engineering, you will be responsible for...

• Developing and enabling advanced package technologies for post-fab wafer finish and assembly processes.
• Improving product quality, yield, productivity, and manufacturing cost.
• Partnering with process and product engineering teams to integrate semiconductor technologies.
• Driving yield improvements through package integration innovation, layout optimization, design improvements, and process margin enhancement.
• Collecting and analyzing data to support design, layout, and integration flow decisions.
• Collaborating with Probe, Yield Analysis, Test, Product Engineering, PWF Engineering, Assembly Engineering, Front-End Wafer Fab, Assembly/Test Engineering, and Global Quality teams.
• Ensuring robust quality through process monitoring, inspection, testing, SPC, DOE, and defect analysis.
• Supporting product transition from development through qualification into High Volume Manufacturing (HVM).
• Providing Process of Record (POR) and Model of Record (MOR) documentation.

What you already have...

• B.S./M.S./Ph.D. (or equivalent) in Electrical, Mechanical, Chemical Engineering, Physics, Materials Science, or related discipline.
• 2+ years of semiconductor process integration experience, preferably in advanced packaging, post-fab wafer finishing, or assembly processes.
• Proficiency in Python, R, and SQL.
• Experience with Visual Basic.
• Knowledge of E3, FDC, and RMS (Recipe Management System).
• Strong statistical analysis, process modeling, SPC, DOE, defect analysis, and dashboarding skills.
• Strong understanding of semiconductor process flows and integration.
• Strong root-cause analysis and complex problem-solving capability.
• Ability to work under tight timelines and limited resources.