Principal Engineer, Advanced Packaging & AI Enablement

Micron Technology, Inc.; Singapore; On-site; SGD 90,000 - 140,000; Full time

Job summary

Micron Technology, Inc. is seeking a Process Development Engineer to design and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking.

The role focuses on quality, yield, cost reduction, and manufacturability while coordinating with multiple internal teams. You will work on AI-enabled enhancements, collaborate across Packaging Integration, Assembly, Front End, and Quality groups, and ensure smooth transitions from development to

Qualifications

• B.S./M.S./Ph.D. (or equivalent education) in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
• 2+ years of semiconductor process development or equipment evaluation in wafer bonding, die stacking and packaging.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies (wafer-level packaging, die stacking).
• Improve product quality, drive yield improvements, reduce costs, and boost productivity.
• Provide POR/MOR documentation for product transfer to high-volume manufacturing facilities.

Skills

Python

R

SQL

Visual Basic

E3

FDC

RMS

DOE

SPC

Data analytics

Education

B.S./M.S./Ph.D. in Materials Science or related technical field

Tools

Visual Basic for automation

E3 / Fault Detection and Classification

RMS / Recipe Management System

Job description

Micron Technology, Inc. is seeking a Process Development Engineer to design and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking.

The role focuses on quality, yield, cost reduction, and manufacturability while coordinating with multiple internal teams. You will work on AI-enabled enhancements, collaborate across Packaging Integration, Assembly, Front End, and Quality groups, and ensure smooth transitions from development to