Packaging Integration Engineer for Advanced Semiconductors

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a results-driven engineer to develop advanced package technology for post-fab processes.

You will focus on improving product quality, driving yield gains, and reducing costs while working with process and product engineering teams. Responsibilities include data analysis to influence layout, design, or integration flow changes and collaboration with Yield Analysis, Test, and Engineering teams to implement improvements.

Qualifications

• We require a bachelor's or higher in engineering/science.
• Strong analytical and problem solving abilities.
• Effective communication across teams.
• Growth mindset and continuous learning.

Responsibilities

• Develop and enable advanced package technology for post-fab processes.
• Improve product quality, yield, and productivity while reducing costs.
• Collaborate with process, product, and engineering teams to integrate steps.
• Analyze data to guide layout, design, or integration flow changes.
• Work with Probe, Yield Analysis, Test, and Product Engineering on improvements.
• Maintain POR/MOR documentation for production transfer to fabs.

Skills

Python

R

SQL

Data analytics

Visual Basic

Education

Bachelor’s or advanced degree in Engineering or Science

Tools

Visual Basic

Job description

Micron Semiconductor Asia Operations Pte. Ltd. is seeking a results-driven engineer to develop advanced package technology for post-fab processes.

You will focus on improving product quality, driving yield gains, and reducing costs while working with process and product engineering teams. Responsibilities include data analysis to influence layout, design, or integration flow changes and collaboration with Yield Analysis, Test, and Engineering teams to implement improvements.