Senior Advanced Packaging Tech Integrator

Micron Technology, Inc.; Singapore; Sur place; SGD 180 000 - 280 000; Plein temps

Résumé du poste

Micron Technology, Inc. in Singapore is seeking a Technology Development Process Integrator to develop advanced packaging processes and ensure readiness of new materials, equipment and techniques for next‑gen memory packaging.

You will lead process readiness for new technologies, drive yield, quality and reliability improvements, and collaborate with upstream/downstream teams to seamlessly transition from development to pilot and high‑volume production, meeting project milestones.

Qualifications

• PhD/Masters/Bachelor’s degree in Electrical & Electronics, Materials, Mechanical Engineering, Physics or Applied Physics.
• Minimum 6 years' experience in the semiconductor industry or related field.
• Experience in frontend fab process integration or module process.
• Experience in backend advanced packaging wafer/die level process or integration.
• Understanding of silicon integration and CPI interactions.
• Proficiency with simulation tools and data analytics for performance analysis.

Responsabilités

• Develop advanced packaging process solutions and drive readiness for new processes, materials and equipment.
• Lead Technode process readiness, improve yield, quality and reliability through characterization and optimization.
• Collaborate with cross-functional teams to resolve process-related challenges and ensure smooth transitions to production.
• Identify pathfinding opportunities for technology leadership and future packaging capabilities.

Connaissances

Project management

Communication skills

Data analytics

Process integration

Cross-functional collaboration

Wafer bonding

Frontend fab / module process

Formation

PhD/Masters/Bachelor’s in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent

Outils

Simulation tools

Data analytics platforms

Description du poste

Micron Technology, Inc. in Singapore is seeking a Technology Development Process Integrator to develop advanced packaging processes and ensure readiness of new materials, equipment and techniques for next‑gen memory packaging.

You will lead process readiness for new technologies, drive yield, quality and reliability improvements, and collaborate with upstream/downstream teams to seamlessly transition from development to pilot and high‑volume production, meeting project milestones.