Advanced Packaging Integration Engineer

Micron Technology, Inc.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an Engineer for Advanced Packaging Integration (APTD CEM) to drive development of packaging technologies and integration across post-fab processes.

You will collect and analyze data to improve yields, quality, and productivity while collaborating with process, product, and test teams to enable smooth technology transfer to high-volume production. The role requires a degree in Engineering or Science, strong analytical abilities, and experience with

Qualifications

• Bachelor’s or advanced degree in Engineering or Science is required.
• Strong analytical, logical, and critical thinking skills.
• Experience with Python, R, SQL for data analytics is preferred.

Responsibilities

• Develop and enable advanced packaging integration for post-fab processes.
• Analyze data and drive yield improvements and cost reductions.
• Collaborate with cross-functional teams to transfer technology to production.

Skills

Python

R

SQL

Visual Basic

Education

Bachelor’s or advanced degree in Engineering or Science

Tools

Visual Basic for automation

Job description

Micron Technology, Inc. in Singapore is seeking an Engineer for Advanced Packaging Integration (APTD CEM) to drive development of packaging technologies and integration across post-fab processes.

You will collect and analyze data to improve yields, quality, and productivity while collaborating with process, product, and test teams to enable smooth technology transfer to high-volume production. The role requires a degree in Engineering or Science, strong analytical abilities, and experience with