Advanced Packaging Engineer: Die-Level & Wafer-Stacking Tech

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 90,000 - 120,000; Full time

Job summary

Micron Singapore seeks a Process Development professional to optimize assembly processes for advanced packaging, including wafer-level packaging and die stacking. You will drive quality, yield, and productivity improvements across multiple semiconductor teams.

The role requires strong analytical skills, collaboration across packaging, fabrication, and quality teams, and a growth mindset to continually learn and implement new technologies. Prior semiconductor exposure is a plus.

Qualifications

• Bachelor's or advanced degree in Engineering or Science is required.
• Strong analytical, logical, and critical thinking skills.
• Effective communicator, able to collaborate across levels.
• Growth mindset with a passion for continuous learning.
• Internship or experience in the semiconductor industry is a plus.
• Demonstrated leadership and a track record of impact is desirable.
• Interest in semiconductor industry and Micron is preferred.
• Proficiency in Python, R, SQL for data analytics and process modeling.
• Experience with automation tools and integration is advantageous.

Responsibilities

• Develop and optimize assembly processes for advanced packaging technologies, including wafer-level packaging and die stacking Chip on Wafer, Chip to Wafer.
• Focus on improving product quality, driving yield improvements, reducing costs, and enhancing productivity.
• Establish and improve process management projects to deliver technology node requirements.
• Evaluate and promote new equipment and materials to enhance process capabilities.
• Set up process parameters for a variety of semiconductor equipment.
• Establish correlations between defense mechanisms to identify improvement opportunities
• Conduct continuous data analysis to establish advanced controls and identify improvement opportunities
• Work closely with internal and external stakeholders to build and execute technology development strategies
• Provide POR and MOR documentation for product transfer to high-volume manufacturing facilities

Skills

Analytical thinking

Communication skills

Leadership potential

Data analytics

Python/R/SQL

VB for automation

Semiconductor experience

Education

Bachelor's or advanced degree in Engineering or Science

Tools

Visual Basic

Job description

Micron Singapore seeks a Process Development professional to optimize assembly processes for advanced packaging, including wafer-level packaging and die stacking. You will drive quality, yield, and productivity improvements across multiple semiconductor teams.

The role requires strong analytical skills, collaboration across packaging, fabrication, and quality teams, and a growth mindset to continually learn and implement new technologies. Prior semiconductor exposure is a plus.