NPI Package Design Engineer – High-Volume IC Packages

Cirrus Logic; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

Cirrus Logic is seeking a packaging design engineer to lead high-volume package layouts for Amps, Codecs and DSPs. You will work with global IC and board teams to ensure electrical, thermal and mechanical requirements are met, using AutoCAD, SiP Layout, and related tools to deliver robust packaging solutions.

The role emphasizes collaboration with customers and internal teams to optimize die-to-PGA interfaces, improve yields, and push automation across the design flow in a fast-paced environment.

Qualifications

• B.S. or higher degree in Mechanical or Electrical Engineering.
• 5-10 years’ experience designing for manufacturability.
• Experienced Cadence SiP layout user.
• Strong AutoCAD user.
• Knowledge of packaging technologies, materials, package substrate design, and assembly rules.
• Understanding of electrical simulation results on a package design.

Responsibilities

• Design package layouts, stack-ups, drawings, models, simulations, and design documentation to verify compliance with requirements and design standards.
• Work tightly with Global Design (UK and US) IC and board teams to drive package designs that meet performance, reliability, and manufacturability requirements.
• Interface with cross functional teams (Design, Layout) to define package requirements from electrical, thermal, and mechanical point of view.
• Utilize AutoCAD, GDS tools, Siemens Fast3D and Cadence SiP Layout tool to complete physical design, electrical simulation, and manufacturing validation solution for package design, including die bump array/BGA integration refinement using die information.
• Drive continuous improvement processes to assure accuracy between the interface of the package to the die and PCB.
• Collaborate with cross functional teams (Customer, Designers, OSATs) to establish and maintain design rules for WLCSP, wire bond, and other packages.
• Understand DFM checking and modification to improve assembly yield and prevent manufacturing issues.
• Grow and promote automation processes throughout the package design flow.
• Close collaboration with customers to resolve various design issues between the piece part and PCB.

Skills

Cadence SiP layout

AutoCAD

Packaging knowledge

Electrical simulation

DFM experience

Cross-functional collaboration

Education

B.S. or higher in Mechanical or Electrical Engineering

Tools

AutoCAD

Cadence SiP Layout

GDS tools

Siemens Fast3D

Cadence Calibre DR

Job description

Cirrus Logic is seeking a packaging design engineer to lead high-volume package layouts for Amps, Codecs and DSPs. You will work with global IC and board teams to ensure electrical, thermal and mechanical requirements are met, using AutoCAD, SiP Layout, and related tools to deliver robust packaging solutions.

The role emphasizes collaboration with customers and internal teams to optimize die-to-PGA interfaces, improve yields, and push automation across the design flow in a fast-paced environment.