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Cirrus Logic is seeking a packaging design engineer to lead high-volume package layouts for Amps, Codecs and DSPs. You will work with global IC and board teams to ensure electrical, thermal and mechanical requirements are met, using AutoCAD, SiP Layout, and related tools to deliver robust packaging solutions.
The role emphasizes collaboration with customers and internal teams to optimize die-to-PGA interfaces, improve yields, and push automation across the design flow in a fast-paced environment.
For over four decades, Cirrus Logic has been propelled by the top engineers in mixed-signal processing. Our rockstar team thrives on solving complex challenges with innovative end-user solutionsfor the world's top consumer brands. Cirrus Logic is also known for its award-winning culture, which was built on a foundation of inclusion and fairness, meaningful community engagement, and delivering enjoyable employee experiences at every turn. But we couldn’t do it without our extraordinary workforce – and that’s where you come in. Join our team and help us continue to make Cirrus Logic an exceptional place to grow your career!
This is a challenging design/layout position in a high volume, dynamic and fast paced environment, and will have a direct impact on business with external customers by helping create innovation that rocks. Products include top of the line Amps, Codecs and DSPs to name a few. The package design types are a wide variety from WLCSP to wirebond to flip chip. This is a chance to be part of a package design team supporting challenging customer expectations and a growing business.
At Cirrus Logic, we believe that diversity drives innovation, and we are committed to encouraging an open and collaborative culture where different approaches, ideas, and points of view are respected and valued. We aim to promote a workplace where everyone can contribute irrespective of race, color, national origin, religion or belief, gender or gender identity, sexual orientation, age, marital status, pregnancy status, or disability.