Packaging Process Engineer - SI/PI for High-Speed SoCs

BYTEDANCE PTE. LTD.; Singapore; On-site; SGD 70,000 - 110,000; Full time

Job summary

BYTEDANCE PTE. LTD. is seeking a packaging-focused engineer to contribute to the silicon platform team. The role encompasses packaging design, integration, and board-level interconnect to enable robust chip production and deployment.

The candidate will work with front-end chip teams across businesses, ensuring high-speed interfaces and reliable power delivery, while coordinating with designers on interface challenges and packaging strategies.

Qualifications

• Master's degree or above in Microelectronics, Electronics, Communications, Computer Science, or related fields.
• 2+ years of relevant work experience.

Responsibilities

• Provide chip packaging design solutions, including packaging selection, packaging design, packaging implementation, PinMap definition, and board-level interconnection.
• Interface with chip designers and board-level designers to handle interface-related issues.
• Responsible for signal integrity (SI) and power integrity (PI) analysis and optimization.

Skills

Teamwork

Communication

English proficiency

Education

Master's degree in Microelectronics/Electronics/Communications/CS

Tools

EDA tools (packaging & PISI)

Job description

BYTEDANCE PTE. LTD. is seeking a packaging-focused engineer to contribute to the silicon platform team. The role encompasses packaging design, integration, and board-level interconnect to enable robust chip production and deployment.

The candidate will work with front-end chip teams across businesses, ensuring high-speed interfaces and reliable power delivery, while coordinating with designers on interface challenges and packaging strategies.