HBM Reliability Engineering Lead

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD

Singapore

On-site

SGD 200,000 - 260,000

Full time

3 days ago

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Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE LTD is seeking an experienced senior leader for HBM Product Engineering Media Health to drive reliability test development and execution for Micron’s latest HBM products. You will lead a high-performing team, tackle defectivity and intrinsic reliability, and optimize manufacturing test flows to achieve key KPI targets.

The role emphasizes cross-functional collaboration across Fab, TD, GQ, and Quality/Reliability teams, with a focus on AI-enabled

Qualifications

Bachelor’s or Master’s degree in Electrical and Electronics Engineering or related field.
Strong reliability and test development background in semiconductors.
Experience with DRAM/CMOS and device physics is a plus.
Exposure to data analysis and scripting tools such as Python or JMP.

Responsibilities

Develop reliability stress tests, plans, and flows for product reliability.
Define qualification plan with Global Quality and drive gating issue resolution.
Drive extrinsic and intrinsic reliability improvements to meet KPI targets.
Lead root cause analysis for Qual and RMA failures using EFA and PFA.
Provide recommendations on new process conversions to reduce cost and improve yield.
Manage risks with Product Managers/Leads during DPM conversions.
Promote innovation and AI-driven reliability improvements across teams.
Mentor and develop team members; drive project delivery and collaboration.