HBM Reliability Engineering Lead

Micron Technology, Inc.; Singapore; On-site; SGD 180,000 - 260,000; Full time

Job summary

Micron Technology, Inc. in Singapore is seeking an experienced leader for the High Bandwidth Memory Product Engineering Media Health team.

You will drive reliability test development and optimization across DRAM and Interface die stacks, manage qualification programs, and lead root-cause analyses for qual and RMA failures. You will mentor engineers, coordinate with fab, TD, and quality teams, and guide AI-enabled reliability initiatives to reduce DPM and improve yield and cost metrics.

Qualifications

• Bachelor’s or Master’s degree in Electrical and Electronics Engineering or a related field.
• 10+ years in semiconductor industry with product, testing, or reliability experience.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Experience with data analysis, statistics, and scripting tools such as Python or JMP.

Responsibilities

• Define and develop reliability test flows, stress tests, and plans for product reliability.
• Collaborate with Global Quality to define qualification plans and drive issue resolution.
• Drive extrinsic and intrinsic reliability improvements through optimized test flows and strategies.
• Lead root cause analysis of qual and RMA device issues using EFA and PFA and drive improvements.
• Advise fab teams on new process conversions to reduce cost and increase yields.
• Manage risks with Product Managers/Leads and balance innovation with stability.
• Promote AI adoption, coach engineers, and integrate AI into reliability workflows.
• Foster cross-functional collaboration across Fab, HBM Tech Development, Design, and Quality teams.

Skills

AI strategy

Applied ML

Cross-functional collaboration

Mentorship

Project management

Communication

Problem solving

Team leadership

Python

Education

Bachelor's or Master's in Electrical and Electronics Engineering or related field

Tools

Python

Job description

Micron Technology, Inc. in Singapore is seeking an experienced leader for the High Bandwidth Memory Product Engineering Media Health team.

You will drive reliability test development and optimization across DRAM and Interface die stacks, manage qualification programs, and lead root-cause analyses for qual and RMA failures. You will mentor engineers, coordinate with fab, TD, and quality teams, and guide AI-enabled reliability initiatives to reduce DPM and improve yield and cost metrics.