Senior Technical Lead, Reliability & HBM Test

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Semiconductor Asia Operations PTE. LTD. in Singapore is seeking a senior engineer to lead reliability test development for HBM products, driving intrinsic and extrinsic reliability improvements and optimized test flows in Singapore.

You will mentor a high-performing team, collaborate with Fab, TD, GQ and Quality groups, and apply AI-enabled tools to accelerate yield, cost reduction, and cycle time while ensuring risk is managed.

Qualifications

• 10+ years in semiconductor product engineering or related roles.
• Deep understanding of device physics and reliability mechanisms.
• Experience with logic or memory products preferred.
• Strong problem-solving with root-cause analysis.
• Excellent communication and leadership capabilities.

Responsibilities

• Reliability test flow development for product reliability aspects.
• Qualification plan definition and execution management.
• Drive extrinsic/intrinsic reliability and DPM reduction through optimized test flows.
• Root cause analysis for Qual and RMA device issues.
• Process conversions and HVM to improve yield, cost, and reliability.

Skills

Team Leadership

Reliability Test Development

DPM Reduction

Root Cause Analysis

Cross-Functional Collaboration

Education

Electrical and Electronics Engineering (Bachelor's/Master's)

Tools

Statistical Analysis Tools

Scripting (Python/R)

Job description

Micron Semiconductor Asia Operations PTE. LTD. in Singapore is seeking a senior engineer to lead reliability test development for HBM products, driving intrinsic and extrinsic reliability improvements and optimized test flows in Singapore.

You will mentor a high-performing team, collaborate with Fab, TD, GQ and Quality groups, and apply AI-enabled tools to accelerate yield, cost reduction, and cycle time while ensuring risk is managed.