HBM Product Engineering Lead: Yield, Test & Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 190,000; Full time

Job summary

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking a senior engineer to lead the Media Health team responsible for High Bandwidth Memory (HBM) product engineering.

You will drive test coverage, validation, and reliability for next-generation HBM devices, while collaborating with global teams to improve quality, cost, and cycle time. The role requires leadership experience, deep semiconductor knowledge, and willingness to travel internationally (US, Taiwan, Japan).

Qualifications

• Must have strong leadership and mentoring abilities with a track record of solving complex problems.
• Experience applying statistics and data analysis tools to semiconductor engineering challenges.
• Willingness to travel internationally and work on site in Singapore as required.

Responsibilities

• Lead and develop a high-performing team for Media Health in HBM product engineering.
• Optimize test coverage across current and future HBM designs and process nodes.
• Develop and validate next-generation HBM products ensuring reliability and quality.
• Support design verification using CAD tools and Verilog simulations.
• Drive yield improvement and cost reduction through root-cause analysis and issue resolution.
• Mentor team members and manage cross-functional projects to timely deliver solutions.

Skills

Leadership

Root cause analysis

Data analysis

Scripting

Cross-functional teamwork

Communication

Travel readiness

Education

Electrical & Electronics degree

Job description

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD. is seeking a senior engineer to lead the Media Health team responsible for High Bandwidth Memory (HBM) product engineering.

You will drive test coverage, validation, and reliability for next-generation HBM devices, while collaborating with global teams to improve quality, cost, and cycle time. The role requires leadership experience, deep semiconductor knowledge, and willingness to travel internationally (US, Taiwan, Japan).