HBM Product Engineering Lead: Test, Yield & Innovation

Micron; Singapore; On-site; SGD 180,000 - 240,000; Full time

Job summary

Micron Technology, Inc. in Singapore seeks an experienced leader to spearhead a high-performing team for Media Health Manufacturing of next-generation HBM products.

You will drive test coverage, yield improvement, and design verification while collaborating with Fab, Design and Quality teams. The role requires 8+ years in semiconductor product engineering, strong leadership and circuit analysis skills, and willingness to travel internationally.

Qualifications

• Bachelors or Masters in Electrical and Electronics Engineering with 8+ years in semiconductors.
• Product engineering experience is preferred.
• Strong leadership, problem solving and root-cause analysis skills.

Responsibilities

• Optimize test coverage for current and future HBM designs and process nodes.
• Develop, validate and qualify Micron's next-generation HBM products.
• Support design verification and circuit analysis using CAD tools and Verilog simulations.
• Improve yields and reduce test time across DRAM, Interface and stacked die yields.
• Drive innovation, mentor others, and manage cross-functional projects.

Skills

Leadership

Problem solving

Circuit analysis

Statistics

Data analysis tools

Scripting

Communication

Education

Bachelor's/Master's in Electrical and Electronics Engineering

Tools

CAD tools

Verilog simulations

Job description

Micron Technology, Inc. in Singapore seeks an experienced leader to spearhead a high-performing team for Media Health Manufacturing of next-generation HBM products.

You will drive test coverage, yield improvement, and design verification while collaborating with Fab, Design and Quality teams. The role requires 8+ years in semiconductor product engineering, strong leadership and circuit analysis skills, and willingness to travel internationally.