HBM Product Engineer - Yield & AI/ML Innovation

MICRON SEMICONDUCTOR ASIA OPERATIONS PTE. LTD.; Singapore; On-site; SGD 120,000 - 180,000; Full time

Job summary

Micron Technology is seeking a qualified Product Engineer to join the HIG HBM Packaging Product Engineering team in Singapore. You will drive packaging and HBM product engineering initiatives, collaborate with Fab, Technology Development, and cross-functional teams to improve yield, quality, and cycle time, while promoting innovation and leadership across programs.

The role requires a strong background in electrical/mechanical engineering, semiconductor packaging, and data-driven problem

Qualifications

• Bachelor's or Master's degree in Electrical/Electronic/Mechanical Engineering.
• 3+ years of experience in the semiconductor industry.
• Experience in Product Engineering and Packaging is preferred.
• Strong problem solving with root cause analysis.
• Good knowledge of statistics and data analysis; scripting experience.
• Experience in test flow handling.
• Assembly process and advanced packaging experience is a plus.
• Willingness to lead technical programs and collaborate across teams.
• Strong communication and presentation skills.
• Willing to travel internationally (Taiwan, US, Japan).

Responsibilities

• Yield and DPM improvement in assembly processes.
• HBM Cube yield improvement through test optimization.
• Lead cross-functional initiatives to improve overall yield and quality.
• Root cause analysis of Qual and RMA packaging issues.
• Develop process conversions to improve yield, cost, and performance.
• Collaborate with Fab, Technology Development, and Packaging teams.
• Promote innovation and maintain competitive edge.
• Develop project management within the team for timely delivery.
• Make technical decisions on risk analysis and prioritization.
• Collaborate on AI/ML models to improve KPIs.

Skills

Electrical Engineering

Mechanical Engineering

Data analysis

Statistics

Problem solving

Team collaboration

Education

Bachelor's/Master's in Electrical/Electronic/Mechanical Engineering

Tools

Circuit analysis tools

Scripting (Python)

Data analysis tools

Job description

Micron Technology is seeking a qualified Product Engineer to join the HIG HBM Packaging Product Engineering team in Singapore. You will drive packaging and HBM product engineering initiatives, collaborate with Fab, Technology Development, and cross-functional teams to improve yield, quality, and cycle time, while promoting innovation and leadership across programs.

The role requires a strong background in electrical/mechanical engineering, semiconductor packaging, and data-driven problem